Vacuum plated copper jewelry

A technology of vacuum plating and copper decoration, applied in decorations, other household appliances, household appliances, etc., can solve the problems of easy peeling off of the coating and anti-oxidation.

Active Publication Date: 2015-12-02
LIUZHOU XUPING JEWELRY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a vacuum copper-plated ornament to solve t

Method used

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  • Vacuum plated copper jewelry

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Embodiment Construction

[0006] Below in conjunction with accompanying drawing, the present invention is described in further detail:

[0007] Such as figure 1 The hand vacuum copper-plating ornament shown includes a copper substrate 1, and the surface of the copper substrate 1 is sequentially coated with a first brass tin layer 2, an alkali copper layer 3, a copper sulfate layer 4, a cupronickel tin layer 5, and a second Brass tin layer 6, palladium cobalt layer 7, titanium nitride layer 8 and gold layer 9, gold layer 9 is the surface layer of copper decoration. The coating sequence of the present invention is especially suitable for the electroplating of copper ornaments with complex workmanship without artificial gemstone inlays. The resulting fashion jewelry coating has strong bonding force and oxidation resistance to the substrate, and the plating layer will not fall off or fade when worn 3 to 4 times. The phenomenon.

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Abstract

The invention discloses a vacuum plated copper jewelry, and relates to the technical field of jewelry. The vacuum plated copper jewelry comprises a copper substrate provided with brass-tin layers and a tutenag-tin layer, wherein the surface of the copper substrate is successively plated with the first brass-tin layer, an alkaline copper layer, a copper sulfate layer, the tutenag-tin layer, the second brass-tin layer, a palladium-cobalt layer, a titanium nitride layer and a gold layer. Compared with the prior art, the vacuum plated copper jewelry provided by the invention can solve the problems of easy falling-off and decoloring and poor oxidation resistance of a plating layer of a conventional copper jewelry.

Description

technical field [0001] The invention relates to the technical field of jewelry, in particular to a vacuum-plated copper ornament. Background technique [0002] Vacuum plating is to deposit various metal films on the surface of the plated parts by means of distillation or sputtering under vacuum conditions. In this way, a very thin surface coating can be obtained. The pursuit of fashion jewelry is ornamental and time-sensitive, and it will be replaced by new fashion jewelry after a season; therefore, fashion jewelry is usually made of copper as the base material into various complex and fancy copper ornaments, and then the copper ornaments are passed through a vacuum Plating makes its surface deposited with gold or silver to become a fashion jewelry. There is a fashion ornament, which includes a copper substrate, and the surface of the copper substrate is sequentially plated with a brass tin layer, a cupronickel tin layer and an imitation gold layer made of colored paint. T...

Claims

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Application Information

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IPC IPC(8): B32B9/00B32B9/04B32B15/20B32B33/00
CPCB32B9/00B32B9/041B32B15/20B32B33/00B32B2311/04B32B2311/12B32B2311/16B32B2311/18B32B2311/22B32B2451/00
Inventor 李冬梅
Owner LIUZHOU XUPING JEWELRY
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