Double-sided adhesive tape attaching device and method

A double-sided adhesive and sticking technology, which is applied in lamination devices, mounting board safety devices, chemical instruments and methods, etc., can solve the problems of low sticking accuracy and sticking efficiency

Active Publication Date: 2015-12-02
BOE TECH GRP CO LTD +1
View PDF6 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide a double-sided tape attaching device and a double-sided tape attaching method, which ca...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Double-sided adhesive tape attaching device and method
  • Double-sided adhesive tape attaching device and method
  • Double-sided adhesive tape attaching device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] In this embodiment, the manipulator is as figure 1 As shown, it includes a double-sided tape manipulator 301 and a circuit board manipulator 302, and the preset stations include the first station ① and the second station ②.

[0052] In this case, the worktable 20 is connected with the driver 10 for rotating under the driving of the driver 10 . Wherein, it can be rotated clockwise or counterclockwise, which is not limited in the present invention.

[0053] Based on this, the double-sided tape manipulator 301 is located at the first station ①, and is used to place a double-sided tape 40 on the positioning mechanism 201 when the workbench 20 rotates a positioning mechanism 201 to the first station ①, and The first protective film 401 of the double-sided adhesive is torn off, exposing the first adhesive surface A.

[0054] The circuit board manipulator 302 is located at the second station ②, and is used to press the double-sided adhesive tape 40 located at the first stati...

Embodiment 2

[0058] In this embodiment, the above-mentioned manipulator is as Figure 3a As shown, it may include a first double-sided tape manipulator 303 , a second double-sided tape manipulator 304 , a first circuit board manipulator 305 , and a second circuit board manipulator 306 . The preset stations include a first station ①, a second station ②, a third station ③ and a fourth station ④.

[0059] In this case, the worktable 20 is connected with the driver 10 for rotating under the driving of the driver 10 .

[0060] Based on this, the first double-sided tape manipulator 303 is located at the first station ①, and is used to place a double-sided tape 40 on the positioning mechanism 201 when the workbench 20 rotates a positioning mechanism 201 to the first station ①.

[0061] The second double-sided adhesive manipulator 304 is located at the second station ②, and is used to turn the double-sided adhesive located at the second station ② when the workbench 20 rotates the double-sided adh...

Embodiment 3

[0093] In this embodiment, the manipulator is as figure 1 As shown, it includes a double-sided tape manipulator 301 and a circuit board manipulator 302, and the preset stations include the first station ① and the second station ②.

[0094] In this case, the method, such as Figure 6 shown, including:

[0095]S201, the workbench 20 is rotated, and a positioning mechanism 201 is rotated to the first station ①.

[0096] S202 , the double-sided tape manipulator 301 located at the first station ① places a double-sided tape 40 on the positioning mechanism 201 .

[0097] S203 , the positioning mechanism 201 fixes the adhesive layer 404 of the double-sided adhesive tape 40 and the second protective film 402 .

[0098] S204. The double-sided tape manipulator 301 located at the first station ① tears off the first protective film 401 of the double-sided tape 40, exposing the first adhesive surface A.

[0099] S205, the workbench 20 is rotated, and the double-sided adhesive tape 40 lo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The embodiment of the invention provides a double-sided adhesive tape attaching device and method and relates to the field of preparation of electronic products. The problem that the attachment precision and attachment efficiency are low when double-sided adhesive tape is attached to the back face of a printed circuit board assembly (PCBA) can be solved. The double-sided adhesive tape attaching device comprises a driver, a workbench and manipulators arranged above the workbench. The manipulators are connected with the driver and used for putting the double-sided adhesive tape at the preset station of the workbench under driving of the driver, tearing off a first protective film of the double-sided adhesive tape at the preset station, pressing a printed circuit board on the double-sided adhesive tape with the first protective film torn off at the preset station and taking down the printed circuit board attached with the double-sided adhesive tape from the preset station. A positioning mechanism is arranged at the preset station, and used for fixing an adhesive layer and a second protective film when the manipulators are used for tearing off the first protective film and releasing fixation of the adhesive layer and the second protective film when the double-sided adhesive tape is attached to the printed circuit board.

Description

technical field [0001] The invention relates to the field of electronic product preparation, in particular to a double-sided tape attaching device and a double-sided tape attaching method. Background technique [0002] In the preparation process of electronic products, PCBA (English: Printed Circuit Board Assembly, Chinese: printed circuit board) is widely used as a support for electronic components. In order to enable PCBA to be fixed and shared with the complete system of electronic products. It is necessary to attach double-sided adhesive or double-sided conductive adhesive to the back of the PCBA. [0003] In the prior art, the double-sided adhesive is generally manually pasted on the back of the PCBA. However, manual attachment has the problems of low accuracy and efficiency. Contents of the invention [0004] Embodiments of the present invention provide a double-sided tape attaching device and a double-sided tape attaching method, which can solve the problem of lo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B65H37/04
CPCH05K3/0058H05K7/1417B32B7/12B25J9/0096B32B37/12B32B38/10B32B2457/08H05K1/00B32B38/00B32B37/00B32B37/10B65G29/00B65G47/90H05K13/0069
Inventor 章善财侯程成张月圆李恒滨胡明
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap