Double-component low-modulus organosilicon sealant for LED (light-emitting diode) packaging and preparation method thereof

Abstract

The invention relates to a double-component low-modulus organosilicon sealant for LED (light-emitting diode) packaging and a preparation method thereof, belonging to the technical field of organosilicon sealants. The sealant comprises a component A and a component B. The component A comprises the following raw materials in parts by weight: 95-100 parts of 107-base adhesive, 5-8 parts of crosslinking agent propyl silicate, 20-25 parts of fumed silica and 2-9 parts of coupling agent KH-550. The component B comprises the following raw materials in parts by weight: 2.5-5.5 parts of catalyst, 10-20 parts of diluter and 5-25 parts of chain extender. By selecting and using the molecular weight of the hydroxyl-terminated dimethyl siloxane and the multiple chain extenders and adding the other assistants, the prepared double-component low-modulus tough organosilicon packaging material is suitable for LED packaging.

Description

Technical field [0001] The present invention involves an organic silicon sealing and its preparation methods. More specifically, the invention involves a LED packaging with dual -component low -modular silicon sealing and its preparation methods, which belongs to the field of organic silicon sealing technology. Background technique [0002] Special requirements for sealing materials such as high -rise buildings, large concrete facilities, highways, and airport runways are required, and new organic silicon sealing materials products are required for low -modular and high extension rates.In addition, the production process of LED products also requires low -modular and tough special organic silicon sealing materials.According to the design of polymer synthetic molecules, by adding chain expansion agents, while the organic silicon sealing materials are added, while the basic polymer molecular chain is lengthened, the cross -linking density in the network structure is reduced, so tha...

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problem that the low-modulus organosilicon sealant in the prior art has no two-component products, and its toughness is poor, so it is not suitable for LED packaging. It provides a two-component low-modulus organic silicone sealant for LED packaging. Silicone sealant, the sealant is a two-component product with strong toughness