Camera shooting module and manufacturing method thereof

Abstract

The invention discloses a camera shooting module and a manufacturing method thereof, wherein the manufacturing method comprises the following steps of: providing a photosensitive chip; fixing one side of the photosensitive chip, away from a package glass, on a substrate by welding; irradiating a photosensitive adhesive via the package glass with a ultraviolet light of which central wavelength is a first wavelength, removing viscidity of the photosensitive adhesive, and taking down the package glass; fixing a pedestal at one side of the substrate away from the photosensitive chip; and fixing a lens at one side of the photosensitive chip away from the substrate. The flow above shows that the camera shooting module manufactured by the manufacturing method is free from the problem of poor light transmittance and poor imaging effect caused by presence of the package glass, and a binding technology with complex process and high cost is not needed, so that the manufacturing method realizes the aim of manufacturing the camera shooting module having better imaging effect with simple production process and lower production cost.

Description

technical field [0001] The invention relates to the field of optical imaging, more specifically, to a camera module and a manufacturing method thereof. Background technique [0002] The production process of modern camera modules mainly includes Chip Scale Package (CSP) process and Chip On Board (COB) process. Among them, the CSP process is used to produce the camera module. First, use resin glue to fix the photosensitive chip on the surface of the packaging glass, then weld the side of the photosensitive chip facing away from the packaging glass to the substrate, and fix the side of the substrate facing away from the photosensitive chip to the base, and finally The lens of the camera module is fixed on the side of the photosensitive chip away from the substrate to complete the production of the camera module, and the packaging glass is used to protect the photosensitive chip during the welding process. However, due to the existence of the packaging glass, the light transm...

AI Technical Summary

Problems solved by technology

Because there is no packaging glass on the surface of the photosensitive chip of the camera module manufactured by the COB process, its imaging effect is better than that of the camera module manufactured by the CSP process, but also because the photosensitive chip of the camera module manufactured by the COB process There is no encapsulation glass on the surface of the chip to protect the photosensitive chip, so when using the COB process to produce the camera module, the photosensitive chip cannot be fixed on the substrate by welding process, but the process is more complicated and the cost is higher. high bonding process

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