A preparation method of flexible neural microelectrode pads for visual prosthesis
A visual prosthesis and micro-electrode technology, applied in the direction of electrodes, internal electrodes, medical science, etc., can solve the problems of poor heat resistance, low permeability and biocompatibility, and achieve the effect of improving the electrode pad part
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Embodiment 1
[0032] Such as figure 1 As shown in (a)-(f), this embodiment provides a method for preparing a flexible neural microelectrode pad for a visual prosthesis combined with parylene and polyimide, which is prepared according to the following steps:
[0033] 1. If figure 1 As shown in middle (a), deposit a layer of parylene (Parylene C) film 5-20 microns on the silicon substrate;
[0034] 2. If figure 1 As shown in (b), on the parylene film deposited in the first step, a patterned metal film layer is formed by sputtering, photolithography and ion beam etching. The material of the metal film layer is gold (Au) , with a thickness of 100-300 nanometers; in order to ensure good adhesion between the inert metal gold and the underlying parylene, it is necessary to deposit a layer of active metal chromium (Cr) as a seed layer with a thickness of 10-30 nanometers; spin-coat photoresist And expose 25 solder joint holes, etch away the parylene below all solder joint holes by reactive ion e...
Embodiment 2
[0043] This embodiment provides a method for preparing a flexible neural microelectrode pad for a vision prosthesis combined with parylene and polyimide similar to that of Embodiment 1. The specific process is as follows:
[0044] 1. Deposit a layer of parylene C (Parylene C) film of 5-20 microns on the glass substrate;
[0045] 2. On the deposited parylene film, a patterned metal film layer is formed by sputtering, photolithography and ion beam etching. The metal film layer is made of platinum (Pt) and has a thickness of 100 to 300 nanometers; In order to increase the adhesion of the inert metal platinum and the underlying parylene, a layer of titanium (Ti) needs to be deposited first, with a thickness of 100 nanometers; the poly pairs under all solder joint holes are etched away by reactive ion etching (RIE). Xylene;
[0046] 3. On each circular platinum solder joint at the pad end, use photolithography to form a circular polyimide (Polyimide) whose inner diameter and outer...
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