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Method for preventing golden finger lead on printed circuit board (PCB) from generating burrs and tilting

A gold finger guide line and gold finger technology, which is applied in the direction of electrical connection formation of printed components, electrical connection of printed components, printed circuit components, etc., can solve problems such as burrs or warping of gold finger guide lines, to increase the area and improve burrs , Improve the lifting effect

Active Publication Date: 2015-12-23
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem in the prior art that burrs or warps are likely to occur on the gold finger guide line when making beveled edges on the gold finger guide line of the PCB, and provides a method for preventing burrs and warping of the gold finger guide line on the PCB.

Method used

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  • Method for preventing golden finger lead on printed circuit board (PCB) from generating burrs and tilting
  • Method for preventing golden finger lead on printed circuit board (PCB) from generating burrs and tilting
  • Method for preventing golden finger lead on printed circuit board (PCB) from generating burrs and tilting

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Embodiment

[0017] refer to figure 1 , the present embodiment provides a method for preventing burrs and warping of the golden fingers on the PCB. 23 and gong empty area 24.

[0018] The PCB uses the positive film process to make the outer layer circuit. In the graphics drawn on the film, the width of the gold finger guide graphic is designed to be 0.25±0.025mm, and the end connecting the gold finger guide graphic and the gold finger graphic is designed as a horn shape. That is to say, both sides of the golden finger guide line figure are arc-shaped, and the radius of the circle where the arc is located is 0.3mm, and the central angle corresponding to the arc of the present embodiment is 90° (in other implementations, the corresponding arc can also be designed The central angle n of the film is 0<n≤90°); the hypotenuse area graphics and the gong empty area graphics are drawn on the film according to conventional techniques; through the exposure and development process, the graphics on th...

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Abstract

The invention relates to the technical field of circuit board production, in particular to a method for preventing a golden finger lead on a printed circuit board (PCB) from generating burrs and tilting. One end, which is connected with a golden finger, of the golden finger lead is designed into a trumpet shape; and the connected part of the golden finger lead and the golden finger is relatively wide, so that the problem that the golden finger lead tilts and falls off when a bevel edge is fabricated is solved. The width of the golden finger lead is set to be 0.25+ / -0.025mm, so that the problem that the burrs are generated on the golden finger lead can be solved; and the quality of a product is ensured. A bevel edge area is set into an oil coating area and an oilless area; the area of the golden finger lead covered by a solder resist ink is increased;and the adhesive force of the golden finger lead on the board can be increased, so that the problem that the golden finger lead tilts and falls off is further solved.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for preventing burrs and warping of golden fingers on a PCB. Background technique [0002] With the rapid development of communication electronics and consumer electronics products, the growth of electronic connectors has been promoted. At the same time, the complexity of terminal products leads to the diversification of the structure of electronic connectors, such as: electronic connectors for sleeves, electronic connectors for interfaces, electronic connectors for internal assembly, golden fingers, etc. These connectors are from practicality Considering that, it is developing in the direction of miniaturization, complexity, light weight, multi-function, high reliability, and long life. The role of the gold finger is to provide low contact resistance for the contact between the separation device and other hardware, while the nickel-gold plating is to e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/40
CPCH05K1/117H05K3/403H05K2201/09727H05K2203/304
Inventor 刘建辉白会斌谢国瑜梁健志
Owner JIANGMEN SUNTAK CIRCUIT TECH
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