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MEMS pressure sensor covering method and device

A pressure sensor and glue dispensing device technology, applied in measurement devices, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of chip damage, low efficiency, contact with chips, etc., to improve productivity, improve stability, reduce The effect of human intervention

Inactive Publication Date: 2015-12-30
WUXI CHINA RESOURCE MICRO ASSEMBLY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The size of the product cover is small, 3.8*4.8mm, such as image 3 As shown, for manual operation, the efficiency is very low, and the tweezers may touch the chip, causing damage to the chip

Method used

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  • MEMS pressure sensor covering method and device
  • MEMS pressure sensor covering method and device
  • MEMS pressure sensor covering method and device

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Embodiment Construction

[0021] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0022] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0023] Secondly, the present invention is described in detail in combination with schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional view showing the device structure will not be partially enlarged according to the gener...

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PUM

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Abstract

The invention discloses a MEMS pressure sensor covering method and device. The method comprises by a dispensing device, coating the edges of a groove of an MEMS pressure sensor with glue, and sucking and putting a cover into the groove of the MEMS pressure sensor by a suction device so that a covering process is finished. Compared with the prior art, semiautomatic production is realized, manual intervention is reduced, product quality stability is improved and production power is improved. In covering, an operator is far from chemical products such as glue and environment-health-safety (EHS) protection of an operator is realized.

Description

technical field [0001] The invention belongs to the technical field of pressure sensors, and relates to a capping method and a capping device for MEMS pressure sensors. Background technique [0002] MEMS pressure sensors are thin-film elements that deform when subjected to pressure. This deformation can be measured with strain gauges (piezoresistive type sensing) or by capacitive sensing of the change in distance between the two faces. It is widely used in the automotive industry, medical market and industrial fields. [0003] A new automotive application of MEMS pressure sensors is driveline pressure sensing, typically in automatics but also in newer dual-clutch drivetrains. Prior Art has introduced a MEMS solution that uses oil to protect the silicon membrane, allowing it to withstand pressures of up to 70 bar. [0004] MEMS pressure sensors are used in the medical market primarily as disposable, low-cost catheters for surgical use. But they are also used in expensive ...

Claims

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Application Information

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IPC IPC(8): B81C1/00B81B7/00
Inventor 王从亮韩林森龚平
Owner WUXI CHINA RESOURCE MICRO ASSEMBLY TECH
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