Multi-wire cutting device applied to block forming of silicon ingot

Abstract

The invention provides a multi-wire cutting device applied to block forming of a silicon ingot. The multi-wire cutting device comprises a base, a bearing table arranged on the base for bearing the silicon ingot to be cut and a cutting mechanism. The bearing table is provided with a plurality of bearing assemblies which are arranged in parallel, and a cutting clearance is reserved between every two adjacent bearing assemblies. Each bearing assembly comprises a pair of bearing supports, a traction roller, a traction belt arranged on the traction roller in a sleeving manner, and a first drive motor. The cutting mechanism comprises a cutting support arranged on the base, at least one pair of cutting rollers erected on the cutting support, cutting wires and a second drive motor. The cutting wires are correspondingly wound on at least one pair of cutting rollers to form a cutting net. The cutting wires on the cutting rollers are used for cutting the silicon ingot to be cut on the bearing table under the drive of the second drive motor, and the cutting wires are located in the cutting clearances when cutting the silicon ingot. According to the multi-wire cutting device, a workpiece can be cut into blocks, the workpiece to be cut is controlled by a microcontroller to rotate, automatic control is achieved in the whole process, and the cutting effect is good.

Description

technical field [0001] The invention relates to the field of cutting, in particular to a multi-wire cutting device applied to square silicon ingots. Background technique [0002] Wire cutting technology is a relatively advanced processing technology at present. The principle is to rub the workpiece to be processed through high-speed moving diamond wire, so as to achieve the purpose of cutting. During the cutting process of the workpiece, the diamond wire is guided by the guide wheel to form a wire net on the main wire roller, and the workpiece to be processed is fed by the movement of the worktable. Under the action of the pressure pump, the assembly The cooling water automatic spraying device on the equipment sprays the cooling water to the cutting part of the diamond wire and the workpiece, and the cutting is generated by the reciprocating motion of the diamond wire to cut hard and brittle materials such as semiconductors into multiple pieces at one time. The wire cutting ...

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Problems solved by technology

[0003] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a multi-wire cutting device, which is used to solve the problem that the existing cutting device needs to cut one by one for many times when obtaining the finished product, which makes the cutting efficiency low, and It is necessary to manually adjust the cutting position, resulting in waste of labor costs and other issues

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