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Adhesive film for organic electronic device and sealing material for organic electronic device comprising same

A technology for organic electronic devices and packaging materials, applied in non-polymer adhesive additives, film/sheet adhesives, circuits, etc., can solve problems such as damage, and achieve the effect of improving life and durability

Inactive Publication Date: 2016-01-06
INNOX ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The object of the present invention is to overcome the deficiencies in the prior art and provide an adhesive film for organic electronic devices and an packaging material for organic electronic devices comprising the adhesive film, which are used to prevent organic damage caused by moisture, oxygen and impurities. Defects in electronic devices, while effectively preventing and removing these causative substances from reaching organic electronic devices, it can prevent the separation, demoulding, cracks and physical damage to organic electronic devices that may occur in the process of removing the above-mentioned causative substances. / Various problems such as chemical damage

Method used

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  • Adhesive film for organic electronic device and sealing material for organic electronic device comprising same
  • Adhesive film for organic electronic device and sealing material for organic electronic device comprising same
  • Adhesive film for organic electronic device and sealing material for organic electronic device comprising same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0132]First, in order to form the first adhesive layer, 50 weights of high-purity (total chlorine content below 500ppm, n=0) silicon-denatured liquid epoxy (XFR-8628) replaced by a silicon intermediate containing phenyl groups and DCPD-type solid Epoxy (HP-7200L, DIC) 50 weight percent epoxy resin 100 weight parts, drop into phenoxy resin (PKHH, Inchem) 100 weight parts to prepare the first bonding component, and to the first bonding component 100 weight parts, as The solvent contained 150 parts by weight of methyl isobutyl ketone, and was stirred at normal temperature for 2 hours. 1.5 parts by weight of an acid anhydride hardener (B4500, DIC) was added to the above-mentioned agitated material with respect to 100 parts by weight of the above-mentioned first adhesive component, and the dispersion coefficient of the particle size shown in Table 1 was added as a diluent and dispersed by an ultrasonic pulverizer. 25 parts by weight of 25% hollow silica (HS300, Sukkyung), after sti...

Embodiment 2～8

[0136] The same method as in Example 1 was carried out, but as shown in Table 1 below, the type and content of the hygroscopic agent contained in the first adhesive layer and the second adhesive layer were changed to obtain the adhesive film shown in Table 1 below.

experiment example 1

[0140] The following physical properties were measured and described in Table 1 and Table 2 for the adhesive films produced in the above Examples and Comparative Examples.

[0141] 1. Moisture penetration evaluation of adhesive film

[0142] After cutting the test piece into a size of 95mm×95mm, remove the protective film and align it on the 100mm×100mm non-alkali glass, 2.5mm inward from the 4 edges of the glass, and then use a film laminating machine heated to 65°C. attached. After removing the release film on the attached test piece, another 100 mm x 100 mm alkali-free glass was covered and laminated at 65° C. for one minute using a vacuum laminator to prepare a sample without air bubbles. After the laminated samples were hardened in a heating furnace at 100°C for three hours, the lengths were observed using a microscope after water infiltration in units of 100 hours in a reliability chamber set at a temperature of 85°C and a relative humidity of 85%.

[0143] 2. Evaluati...

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Abstract

The present invention relates to an adhesive film for an organic electronic device and a sealing material for an organic electronic device comprising the same and, more particularly, to an adhesive film for an organic electronic device and a sealing material for an organic electronic device comprising the same, the adhesive film being capable of removing and blocking defect-causing substances, such as moisture and impurities, such that the same cannot approach the organic electronic device, and also being capable of minimizing occurrence of problems resulting from separation / stripping between the organic electronic device and a film and / or between interfaces of films, which could occur when moisture is removed.

Description

technical field [0001] The present invention relates to an adhesive film for an organic electronic device and an encapsulating material for an organic electronic device including the adhesive film, and in particular to minimizing the amount of moisture, impurities, and other substances that cause defects from approaching the organic electronic device while removing and blocking the access to the organic electronic device. Separation between an organic electronic device and a film and / or the surface of the film that may occur when moisture is removed and problems caused by the separation, an adhesive film for an organic electronic device, and a packaging material for an organic electronic device including the adhesive film. Background technique [0002] An organic light emitting diode (OLED: Organic Light Emitting Diode) is a light emitting diode in which a light emitting layer is formed of an organic compound in the form of a thin film, and utilizes an electroluminescence phe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J11/04H01L51/52H01L51/54
CPCH10K85/324H10K50/846H10K50/8445C09J9/00C09J11/04C09J7/38
Inventor 李晖龙金珍赫李充九具本洙朴定敏
Owner INNOX ADVANCED MATERIALS CO LTD
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