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Polyimide Precursor Solution

A technology of polyimide precursor and polyamic acid, applied in the direction of coating, etc., can solve the problem of difficulty in obtaining polyimide precursor with high degree of polymerization, and achieves easy process control, excellent environmental suitability, and flowability. Good flatness effect

Active Publication Date: 2020-08-07
UNITIKA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if an alcohol mixed with a strong basic compound such as triethylamine or triethylenediamine is used as a polymerization solvent, it is difficult to obtain a polyimide precursor with a high degree of polymerization, and there are also problems in storage stability.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] Dissolve the mixture of polyamic acid powder A and 1,2-dimethylimidazole (pKa 7.7) (use 2.5 moles of 1,2-dimethylimidazole relative to 1 mole of structural units of polyamic acid) at 25°C In ethylene glycol, as a polyimide precursor, polyimide precursor solution A-1 having a concentration of 15% by mass was obtained. Table 1 shows the evaluation results of the properties of the precursor solution.

Embodiment 2

[0066] Dissolve the mixture of polyamic acid powder B and 1,2-dimethylimidazole (pKa 7.7) (use 2.5 moles of 1,2-dimethylimidazole relative to 1 mole of structural units of polyamic acid) at 25°C In ethylene glycol, as a polyimide precursor, polyimide precursor solution B-1 having a concentration of 15% by mass was obtained. Table 1 shows the evaluation results of the properties of the precursor solution.

Embodiment 3

[0068] Except having used 2-ethyl-4-methylimidazole (pKa 8.3) as a basic compound, it carried out similarly to Example 2, and obtained polyimide precursor solution B-2. Table 1 shows the evaluation results of the properties of the precursor solution.

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Abstract

　The purpose of the invention is to provide a polyimide precursor solution having excellent environmental compatibility and good storage stability and leveling properties, the polyimide precursor solution making it possible to produce a polyimide molded article having excellent mechanical strength. The invention provides a polyimide precursor solution obtained by dissolving polyamic acid and a salt of a weakly basic compound having an acid dissociation constant (pKa) of 4.5-8.5 in a solvent containing a polyhydric alcohol.

Description

technical field [0001] The present invention relates to polyimide precursor solutions. A polyimide molded article obtained from this polyimide precursor solution has excellent mechanical strength and high heat resistance. Background technique [0002] Molded products composed of aromatic polyimide obtained from aromatic tetracarboxylic dianhydride and aromatic diamine have excellent properties such as heat resistance, mechanical strength, electrical properties, and solvent resistance, so they can be used in the electronics industry. , Copier field, aviation field and so on are widely used. Due to the lack of solubility of the aromatic polyimide, the polyamic acid as a polyimide precursor is usually dissolved in NMP (N-methyl-2-pyrrolidone), DMF (N,N-dimethyl Formamide), DMAc (N,N-dimethylacetamide) and other amide solvents, the resulting solution is coated on the surface of the substrate, and then cured at high temperature (imidization) to obtain a film , belts and other ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08G73/10
CPCC08G73/105C08G73/1067C08G73/1071C08K5/3432C08K5/3445C09D179/08
Inventor 繁田朗吉田猛山田祐己森北达弥细田雅弘越后良彰
Owner UNITIKA LTD
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