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SIP (System In Package) module design method based on board level verification and test system

A technology of verification testing and module design, which is applied in computing, special data processing applications, instruments, etc., can solve the problems of a single realization stage of a single requirement, no design process, no engineering research, etc., to improve integrity and reduce steps And the lack of process, avoiding the effect of incomplete work

Active Publication Date: 2016-01-27
BEIJING MXTRONICS CORP +1
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Problems solved by technology

[0003] Because the SIP design technology originally originated from the packaging design, the current research on SIP modules is mostly focused on the packaging process, such as interconnection implementation methods and substrate materials, and the system modular design based on the use of SIP technology is still in a single requirement and a single implementation stage, there is no engineering research, nor a complete design process

Method used

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  • SIP (System In Package) module design method based on board level verification and test system
  • SIP (System In Package) module design method based on board level verification and test system

Examples

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Embodiment 1

[0035] Take the design process of a certain type of SIP module (hereinafter referred to as this module) as an example:

[0036] (1) In the principle verification stage, after receiving user requirements or design goals as project start conditions, the first step is to conduct requirement analysis and system software and hardware division;

[0037] The second step is carried out separately and in parallel according to the software and hardware process. The hardware sequence is used to select components and determine the preliminary test plan, board-level design and production, synchronize the software to write the task book, and then write the driver in parallel to plan the development environment.

[0038] This module selects a SoC, an FPGA, a SRAM, a SDRAM and a FLASH, a total of 5 integrated circuit chips as the target components for SIP integration. In this module interconnection design, SoC is used as the main control chip, and SRAM, SDRAM, FLASH and FPGA as an extended peri...

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Abstract

This invention discloses a SIP module design method based on board level verification and test system. The method comprises the following steps: firstly, selecting a to-be-integrated device and design a principle to verify PCB (Printed Circuit Board); writing a driver to complete the principle verification; secondly, performing structure design and wiring design; at last, performing function verification, and completing chip-returning test and function test. Based on the PCB, this method realizes the principle verification, the function verification and the function test, improves integrity of the design of the SIP module, and avoids the problem of incomplete design work; moreover, since the PCB is reused in the design process, the design workload and difficulty are reduced; the efficiency is improved; and the requirements of the SIP module design are satisfied to the most extent.

Description

technical field [0001] The invention relates to a SIP module design method, in particular to a SIP module design method based on a board-level verification test system, belonging to the field of integrated circuit design. Background technique [0002] System-in-Package (SIP) has developed rapidly in recent years. It is an important way to realize the miniaturization, light weight and multi-function of electronic products, and has become an important advanced packaging and system integration technology. The SIP module integrates different types of circuits (mostly bare-die, but also chips and discrete components) into the same package, and realizes some passive device functions, interconnection and Mechanical installation, and finally complete the functions of the whole or part of the system. The integrated circuits can be of different functions, different processes, and different states, which greatly reduces the difficulty and requirements of system integration, improves th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 祝天瑞赵元富兰利东韩逸飞陈雷刘薇王枭鸿赵光忠李志远
Owner BEIJING MXTRONICS CORP
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