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Scraper pressure control system for semiconductor packaging

A pressure control and scraper technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as unstable scraper pressure

Active Publication Date: 2016-01-27
HITECH SEMICON WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a scraper pressure control system for semiconductor packaging to solve the problem of unstable pressure of the existing scraper

Method used

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  • Scraper pressure control system for semiconductor packaging
  • Scraper pressure control system for semiconductor packaging
  • Scraper pressure control system for semiconductor packaging

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Embodiment Construction

[0020] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0021] see figure 1 , the present invention is a scraper 1 applied to semiconductor packaging equipment, the shape of the scraper 1 is, for example, as figure 1 shown.

[0022] The present invention provides a scraper pressure control system for semiconductor packaging, including: a scraper 1, a screen (not shown); wherein, the screen is moved by electromagnetic valve adsorption control, instead of the previous mechanical movement, i...

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Abstract

The invention provides a scraper pressure control system for semiconductor packaging, which comprises a scraper and a screen plate, and is characterized in that the screen plate is controlled to move through an electromagnetic valve; and the scraper is electrically connected to a pressure regulating device. The pressure regulating device comprises a pressure sensor, a pressure feedback unit, a signal processing unit, pressure regulators and a stepping motor, wherein the pressure sensor is used for detecting pressure of the scraper and generating pressure sensing signals; the pressure feedback unit is used for receiving the pressure sensing signals, and generating and outputting pressure feedback signals according to the pressure sensing signals; the signal processing unit is used for receiving the pressure feedback signals, calculating an actual pressure value according to the pressure feedback signals, comparing the actual pressure value with a preset rated pressure value, and outputting triggering signals when the actual pressure value is inconsistent with the rated pressure value; the pressure regulators are used for outputting pressure regulating signals when receiving the triggering signals; and the stepping motor is used for receiving the pressure regulating signals and carrying out pressure regulation control on the scraper according to the pressure regulating signals, thereby realizing stable control for the scraper pressure.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a scraper pressure control system for semiconductor packaging. Background technique [0002] Due to the single structure of the current scraper device in the field of semiconductor packaging, the pressure of the scraper is unstable, and the pressure is often too high or too small, and the resin thickness is uneven; and after the equipment is shut down, the resin is accumulated and refluxed, and the scraping pressure is not good again. Stable phenomenon; lead to FM phenomenon, affecting subsequent processing operations. Contents of the invention [0003] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a squeegee pressure control system for semiconductor packaging to solve the problem of unstable pressure of the existing squeegee. [0004] In order to achieve the above purpose and other related purp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
Inventor 郑昌荣黄春桃
Owner HITECH SEMICON WUXI
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