Chip package structure and method for manufacturing chip package structure
A technology of chip packaging structure and manufacturing method, applied in semiconductor/solid-state device manufacturing, instruments, electrical components, etc., can solve the problems of thick thickness, damage or moisture, increase in height difference between the fingerprint sensing area and the colloid surface, etc. Sensitivity, protection against damage or moisture
Inactive Publication Date: 2016-01-27
CHIPMOS TECH INC
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Problems solved by technology
Filling colloid is formed on the surface of the fingerprint sensing chip to cover the gold wire, but because the fingerprint sensing area is exposed, it is easy to be damaged by collision or damp
Moreover, in order to prevent the gold wire from being exposed, the thickness of the filling colloid is relatively thick, which leads to an increase in the height difference between the fingerprint sensing area and the surface of the colloid, and even reduces the sensitivity of fingerprint recognition
Method used
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[0042] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the accompanying drawings. Accordingly, the directional terms used are illustrative, not limiting, of the invention. Also, in the following embodiments, the same or similar components will be given the same or similar symbols.
[0043] Figure 1A to Figure 1H is a schematic cross-sectional flow diagram of a manufacturing method of a chip packaging structure according to an embodiment of the present invention. The manufacturing method of the chip packaging structure of the present embodiment may include the following steps: first, as Figure 1A As shown, a flexible substrate 110 is pr...
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The invention provides a chip package structure and a method for manufacturing the chip package structure. The chip package structure includes a flexible substrate, a patterned circuit layer, a fingerprint sensor chip, a plurality of bumps, a patterned dielectric layer and an encapsulant layer. The patterned circuit layer disposed on the flexible substrate includes a fingerprint sensing circuit and a plurality of terminals. The fingerprint sensor chip disposed on the flexible substrate is electrically connected to the fingerprint sensing circuit and includes an active surface, a back surface, and a plurality of bonding pads disposed on the active surface. The bumps disposed between the fingerprint sensor chip and the patterned circuit layer electrically connect the bonding pads and the terminals. The patterned dielectric layer including a first surface and a second surface having a fingerprint sensing region at least covers the fingerprint sensing circuit with the first surface. The encapsulant layer is filled between the flexible substrate and the fingerprint sensor chip and covers the bumps.
Description
technical field [0001] The present invention relates to a semiconductor packaging structure and a manufacturing method of the semiconductor packaging structure, and in particular to a fingerprint sensing chip packaging structure and a manufacturing method of the fingerprint sensing chip packaging structure. Background technique [0002] The fingerprint sensing package structure can be additionally installed in various electronic products, such as mobile phones, notebook computers, tablet computers, etc., to identify the user's fingerprint. Currently, fingerprint readers can be manufactured and packaged using semiconductor technology. Different from traditional IC packaging, the fingerprint sensor chip should have an exposed sensing area in order to identify fingerprints. [0003] Generally speaking, a fingerprint sensing package structure mainly includes a substrate, a fingerprint sensing chip, and a filling compound. There is a sensing area on the active surface of the fin...
Claims
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IPC IPC(8): H01L23/31H01L23/498H01L21/50H01L21/56G06K9/00G06V40/13
CPCH01L2224/16225H01L2224/32225H01L2224/73204H01L24/16H01L24/32H01L24/73H01L24/83H01L24/92H01L2224/81205H01L2224/81207H01L2224/83851H01L2224/92125H01L2924/00014H01L2924/07802H01L2924/0781H01L23/4985H01L24/17H01L21/563H01L24/81H01L2224/81203H01L2224/16227G06V40/13H01L2924/00H01L2224/13099H01L2924/07025H01L2924/1579
Inventor 李立钧蔡嘉益
Owner CHIPMOS TECH INC