Automatic back-glue pasting machine

Abstract

The invention discloses an automatic back-glue pasting machine. A circuit board feeding conveying mechanism and a circuit board discharging conveying mechanism can convey circuit boards. A back-glue stripping module can grab back glue in a stock bin one by one, completely strip the back glue from release paper and then place the back glue on a receiving platform. A back-glue conveying device can drive the back-glue receiving platform to move to a set position. A circuit board sucking module can suck the circuit boards on the circuit board feeding conveying mechanism and automatically detect and correct the positions and directions of the circuit boards. A transmission device can drive the circuit board sucking module to move to the position over the back-glue receiving platform, so that the circuit board sucking module presses the circuit boards on the back glue so as to conduct back-glue pasting. A controller controls all components to work. According to the automatic back-glue pasting machine, whole-course automatic operation is achieved, high-speed high-efficiency back-glue pasting is achieved, and manual operation is not needed; the back-glue pasting positions are accurate and consistent, secondary damage to the circuit boards and the back glue is further avoided, and the quality of the circuit boards is guaranteed.

Description

technical field [0001] The invention relates to an automatic equipment, in particular to an automatic back glue sticking machine. Background technique [0002] It is often necessary to paste adhesive on the circuit board to mark the information of the circuit board, so that the relevant information of the circuit board can be understood later. At present, the adhesive on the circuit board is mainly pasted manually. This method of adhesive adhesive is more efficient Low, the back glue is not firmly pasted, it is easy to stick crookedly, and it is easy to damage the back glue and the circuit board, causing secondary damage to the circuit board. At present, other industries also use automatic equipment to stick the back glue, but they only use the back glue Take it off and stick it directly on the surface of the product. When attaching, it will not correct the bonding position of the adhesive, which will cause inconsistent bonding positions of the adhesive on the circuit board,...

AI Technical Summary

Problems solved by technology

[0002] It is often necessary to paste adhesive on the circuit board to mark the information of the circuit board, so that the relevant information of the circuit board can be understood later. At present, the adhesive on the circuit board is mainly pasted manually. This method of adhesive adhesive is more efficient Low, the back glue is not firmly pasted, it is easy to stick crookedly, and it is easy to damage the back glue and the circuit board, causing secondary damage to the circuit board. At present, other industries also use automatic equipment to stick the back glue, but they only use the back glue Take it off and stick it directly on the surface of the product. When attaching, it will not correct the bonding position of the adhesive, which will cause inconsistent bonding positions of the adhesive on the circuit board, affect its aesthetics, and affect the normal function of the circuit board. It will also affect the subsequent processing steps

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