A curing method for avoiding the bulging of the non-adhesive delamination area of ​​the multi-layer flexible board

Abstract

The invention discloses a curing method used for preventing swelling of a glue-free stratified area of a multi-layer soft board. The method comprises the steps that the multi-layer soft board is neatly placed; sides, which contact upper and lower steel boards, of the multi-layer soft board are cleaned; the lower steel board is placed on a multi-layer rack, wherein the smooth side of the lower steel board is upward; the multi-layer soft board is placed on the lower steel board, and the upper steel board with the downward smooth side presses the multi-layer soft board; the multi-layer rack is pushed into an oven for baking, wherein the baking temperature is 150 to 170 DEG C and the baking time is 2 to 2.5 hours; the baked multi-layer rack is pushed out; and after upper and lower steel boards and the multi-layer soft board are cooled, the multi-layer soft board is removed. According to the method of provided by the invention, the problem of swelling of the glue-free stratified area of the multi-layer soft board can be effectively improved; the flatness of the board surface is improved; medicinal liquid is prevented from penetrating into the stratified area when electroplating is carried out; film pasting can be smoothly carried out on an outer line; a dry film which cannot be compacted is avoided; the reliability and the stability of a product are improved.

Description

technical field [0001] The invention relates to the technical field of multilayer flexible board production, in particular to a curing method for avoiding swelling of the non-adhesive layered area of ​​the multilayer flexible board. Background technique [0002] Such as Figure 1 to Figure 4 As shown, for the multi-layer flexible board 100 with adhesive-free delamination area, the air in the adhesive-free delamination area cannot be completely exhausted by ordinary fast pressing method, and a small amount of air in the adhesive-free delamination area cannot be exhausted after long-term high-temperature curing. The thermal expansion of the air will cause the non-adhesive delamination area to bulge. After cooling, the bulging position will produce deformation and wrinkles, resulting in uneven board surface. In serious cases, the glued area will be stretched too far and there is a risk of entering the potion during copper plating. The dry film cannot be compacted when the outer...

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a curing method that avoids the bulging of the non-adhesive delamination area of ​​the multi-layer flexible board, aiming at solving the problem that the multi-layer flexible board suffers from damage in the delamination area after long-term high-temperature curing. Thermal expansion can cause problems with bulging in non-adhesive delaminated areas

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