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liquid cooling radiator

A radiator, liquid cooling technology, applied in cooling/ventilation/heating transformation, semiconductor devices, electric solid devices, etc., can solve the problem of uneven heat exchange capacity of cooling fins, and achieve the effect of maintenance.

Inactive Publication Date: 2018-05-25
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Here, when the width of the inlet of the refrigerant flowing into the flow path space is smaller than the width of the flow path space, there will be a region where the flow rate of the refrigerant is reduced in the flow path space, and the heat exchange capability of the cooling fins will easily deteriorate. uneven

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0025] figure 1 It is a perspective view showing a schematic configuration of the liquid cooling radiator according to Embodiment 1 of the present invention. figure 2 is along figure 1 Oblique view of A-A line observation shown. image 3 is along figure 1 The oblique view of the BB line observation shown.

[0026] The liquid cooling radiator 20 has a radiator base (main body) 1 , a radiator cover (first cover) 2 , and cooling fins 5 . The radiator base 1, the radiator cover 2, and the cooling fins 5 are made of materials with high thermal conductivity such as copper or aluminum. The heat sink base 1 has a box shape in which an opening (first opening) 9 is formed on the top surface. The inside of the box-shaped radiator base 1 serves as a flow path space 1 a through which a refrigerant can pass. The power module 6 as a heat sink is joined to the outer bottom surface of the heat sink base 1 .

[0027] An inflow port 1b through which the refrigerant flows in is formed on ...

Embodiment approach 2

[0040] Figure 9 It is a perspective view showing a schematic configuration of a liquid cooling radiator 25 according to Embodiment 2 of the present invention. Figure 10 is a perspective view of the radiator cover 22 . Figure 11 It is a perspective view of the refrigerant diffusion member 24 . In addition, the same code|symbol is attached|subjected to the same structure as said embodiment, and detailed description is abbreviate|omitted.

[0041] In this Embodiment 2, if Figure 10 As shown, a plurality of slits (second openings) 12 into which a plate-shaped refrigerant diffusion member 24 can be inserted are formed in a radiator cover (first cover) 22 . A packing 9 c is provided on a portion of the refrigerant diffusion member 24 fitted inside the slit 12 . Leakage of the refrigerant from the slit 12 is prevented by inserting a gasket between the slit 12 and the refrigerant diffusion member 24 .

[0042] Part of the slit 12 is formed with a concave portion 13 for easier...

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Abstract

This liquid cooled heat sink is provided with: a main body (1), which has a box shape having a flow channel space (1a) formed therein, said flow channel space being capable of passing through a cooling medium, and which has formed therein an inlet (1b) for flowing the cooling medium into the flow channel space (1a), and an outlet (1c) for flowing out the cooling medium; and a plurality of cooling fins (5) that are provided to stand on the flow channel space (1a) side of the main body (1) such that the cooling fins extend from the inlet (1b) side to the outlet (1c) side. In a planar view, a first opening (9) is formed in a main body region including a region covering the cooling fins (5) and a region covering the side further toward the inlet (1b) than the cooling fin (5), and this liquid cooled heat sink is also provided with: a first cover (2), which covers the first opening (9), and which has a second opening (2a) that is formed in the region covering the side further toward the inlet (1b) than the cooling fin (5); and a cooling medium diffusion member (4) that can be inserted into and removed from the flow channel space (1a) through the second opening (2a).

Description

technical field [0001] The invention relates to a liquid cooling radiator. Background technique [0002] The liquid cooling radiator of a general power conversion device is formed of a metal with high thermal conductivity such as aluminum or copper, and a space (hereinafter referred to as a flow path) that becomes a refrigerant flow path through which a refrigerant (such as a liquid refrigerant) can pass is formed inside. space). In the flow path space, a plurality of cooling fins extending in the direction in which the refrigerant passes is arranged in parallel in a direction perpendicular to the extending direction of the cooling fins. [0003] Various power semiconductor components such as power modules are mounted on a liquid cooling heat sink (hereafter, the power module will be described as a representative example of various power semiconductor components), and the heat generated from the power module passes through the substrate of the heat sink. Diffusion takes pl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/36H05K7/20
CPCH01L2924/0002H01L23/36H05K7/20H01L2924/00
Inventor 中泽瞬
Owner MITSUBISHI ELECTRIC CORP