Packaging improvement structure for LED and improvement method thereof
A technology for light-emitting diodes and improved structures, which is applied to electrical components, electrical solid-state devices, circuits, etc., and can solve problems such as reducing production efficiency, increasing material costs, and complex manufacturing processes.
Inactive Publication Date: 2016-02-10
PROLIGHT OPTO TECH
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Problems solved by technology
[0006] The various insulation methods mentioned above will not only increase the cost of materials, but also the installation of additional circuits or changes in the packaging structure will make the manufacturing process more complicated and greatly reduce production efficiency
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[0023] In order to facilitate understanding of the present invention, the creative thinking of the present invention is briefly described first. Nano-thin film is a material that has received considerable attention recently. When the thickness of the film is as thin as the nanoscale, its optical, electrical, thermal, magnetic, chemical and mechanical properties are significantly different. The application of nano film can be seen in many fields. In the field of optoelectronic components, nanometer thin films are usually applied to structures belonging to optoelectronic components such as electrodes, substrates, or light-emitting layers. However, the present invention does not apply the nano-thin film to the structure of the photoelectric element (for example: light-emitting diode) itself like the known technology, but utilizes the electrical insulation effect produced by the Fermi energy banding phenomenon of the nano-thin film to apply the metal nano-thin film (Powder) thin...
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Abstract
The present invention provides a packaging improvement structure for an LED (Light Emitting Diode) and an improvement method thereof. The packaging improvement structure comprises a pedestal, a plurality of nano metal particles and an LED unit; wherein a containing space is arranged in the pedestal in an indenting way, the containing space has a bottom surface and at least one side surface surrounding the bottom surface; the plurality of nano metal particles cover the bottom surface or the side surface; the LED unit is arranged in the containing space. The nano metal particles reflect / scatter lights emitted from the LED unit, and the diameter of each nano metal particle is less than 10 nanometers, so that electrical insulation is achieved. In this way, through adoption of characteristics of the metal material and the nanoscale, the lights emitted from the LED unit can be reflected / scattered by the nano metal particles to achieve a good light condensing effect, and as an additional insulating material is not in need, the packaging improvement structure of the present invention has the advantages of simple manufacturing process, and reduced material consumption.
Description
technical field [0001] A packaging structure of a light emitting diode, in particular to an improved packaging structure of a light emitting diode capable of reflecting / scattering light and being electrically insulated by using nanometer metal particles. Background technique [0002] Light-emitting diodes (LIGHTEMITTING DIODE, LED) have gradually attracted the attention of the lighting industry due to their small size, low energy consumption, high luminous efficiency, fast response, long life cycle and no pollution. Currently, light-emitting diodes can be seen in various devices such as small devices such as personal digital assistants, smartphones, and tablet computers, all the way to large devices such as monitors or indicator lights. [0003] The most basic light-emitting diode chips must be packaged before they can be used in combination with other devices. Please refer to figure 1 , figure 1 A schematic diagram of a known LED package structure is shown. [0004] fi...
Claims
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Login to View More IPC IPC(8): H01L33/58H01L33/60H01L33/48
CPCH01L2224/48091
Inventor 邢陈震仑洪荣豪林鼎尧
Owner PROLIGHT OPTO TECH