Printed circuit board immersion gold processing method
A printed circuit board and processing method technology, applied in the directions of printed circuit, printed circuit manufacturing, printed circuit secondary processing, etc. The effect of improving operation efficiency, reducing processing cost and reducing area
Active Publication Date: 2018-08-10
SHENZHEN WUZHU TECH
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- Description
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Problems solved by technology
However, the process of wrapping green glue on the PCB is generally done manually, and only one piece can be wrapped at a time, which not only has low production efficiency, but also needs to pay higher labor costs. It requires multiple employees to operate for a long time, which cannot meet the requirements of high flow and high flow rate
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[0024] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0025] Please also see figure 1 with figure 2 ,in, figure 1 It is a schematic flow sheet of the processing method of printed circuit board immersion gold of the present invention, figure 2 It is a schematic diagram of the equipment structure of the processing method of immersion gold for printed circuit boards of the present invention. The invention provides a method for processing printed circuit board immersion gold, comprising the following steps:
[0026] Step S1: providing a printed circuit board 11 to be processed, a gong machine 12 and pins, the printed circuit board 11 to be processed is provided with alignment holes 111, and the gong machine 12 is used to remove the holes of the printed circuit board 11 to be processed frame 112 , the pin 13 is used to fix the printed circuit board 11 to be processed on the machine table 122 of the gong ...
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The invention discloses a processing method for gold immersion of a printed circuit board. The method comprises the following steps: arranging positioning hole information, drilling location holes, fixing board members, arranging milling frame information, arranging logic parameters, simulating frame milling, milling a frame and performing gold immersion. Compared to the prior art, the processing method for the gold immersion of the printed circuit board, provided by the invention has the following advantages: a milling knife is controlled through a milling machine to mill away superfluous frame, a conventional mode of manual coating of a green plastic is replaced, the area of gold salts precipitated in a gold immersion process is reduced, the processing cost of gold immersion in a PCB processing process is decreased, the operation efficiency is improved through a mechanical production process, and while a large production capacity is realized, production requirements for a high flow and a high flow rate are realized.
Description
technical field [0001] The invention relates to the technical field of PCB processing, in particular to a processing method for immersion gold of a printed circuit board. Background technique [0002] In the immersion gold process of the printed circuit board (PCB), in addition to the necessary parts of the PCB board will be immersed in gold salt, the rest of the part not covered by the insulating layer will also be immersed in gold salt, In this case, gold salt will be wasted, resulting in an increase in the cost of gold salt during the entire process of the PCB board. [0003] In the related technology, by using green glue made of insulating material to wrap the excess part of the edge of the PCB board and then enter the immersion gold process, in order to achieve the purpose of saving the cost of gold salt in the entire process of the PCB board . However, the process of wrapping green glue on the PCB is generally done manually, and only one piece can be wrapped at a tim...
Claims
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IPC IPC(8): H05K3/00H05K3/24
CPCH05K3/0044H05K3/24H05K2203/0228
Inventor 梁高蔡志浩邵勇吴有明
Owner SHENZHEN WUZHU TECH