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Light Emitting Diode Devices

A technology of light-emitting diodes and devices, applied in semiconductor devices, electric solid devices, electrical components, etc., can solve the problems of reducing heat extraction efficiency, reducing optical efficiency, increasing the size, cost and complexity of manufacturing lamps, etc.

Active Publication Date: 2018-11-09
LUMILEDS HLDG BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Multiple layers of packaging including, for example, the LED package, PCB, secondary optics, bulb and lamp add to the size, cost and complexity of manufacturing the lamp
Also, multiple layers of encapsulation can reduce light extraction from the lamp because light must be extracted from each layer of the encapsulation and each layer of the encapsulation typically absorbs some light
These same multiple layers of encapsulation can also reduce the efficiency of heat extraction from the LED, thereby further reducing its optical efficiency

Method used

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  • Light Emitting Diode Devices
  • Light Emitting Diode Devices
  • Light Emitting Diode Devices

Examples

Experimental program
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Effect test

Embodiment Construction

[0012] Although in the following examples the semiconductor light emitting device is a III nitride LED that emits blue or UV light, it is possible to use semiconductor light emitting devices other than LEDs such as laser diodes made of materials such as other III-V materials, III phosphides, III Semiconductor light-emitting devices made of arsenide, II-VI materials, ZnO or other material systems such as Si-based materials, or non-semiconductor light-emitting devices.

[0013] In an embodiment of the invention, a lens is formed over the LED. The LEDs are mounted on a conductive frame or substrate, and the body is then molded around the LEDs, lens and conductive substrate. figure 1 An embodiment of the invention is illustrated. Molded body 14 in figure 1 icon at the center of the . The molded body 14 may be, for example, a polymer. In some embodiments, the molded body 14 is a thermally conductive plastic that can conduct heat away from the LED and into air or a conductive su...

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PUM

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Abstract

A device according to embodiments of the invention includes a light emitting diode (LED) mounted on an electrically conducting substrate. A lens is disposed over the LED. A polymer body is molded over the electrically conducting substrate and in direct contact with the lens.

Description

technical field [0001] The present invention relates to light fixtures using solid state light sources integrated into the system without separately packaged LEDs. Background technique [0002] Solid state lighting systems that include LEDs typically have one or more LED dies inside an LED package that is assembled onto a printed circuit board (PCB), sometimes in combination with an electrical driver that can be co-located or separately connected. A PCB containing the LEDs is combined with one or more secondary optics, placed in the bulb and assembled into the lamp. Multiple layers including packaging such as the LED package, PCB, secondary optics, bulb and lamp add to the size, cost and complexity of manufacturing the lamp. Also, multiple layers of encapsulation may reduce light extraction from the lamp, since light must be extracted from each layer of the encapsulation, and each layer of the encapsulation typically absorbs some light. These same multiple layers of encaps...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/54H01L33/58H01L25/16H01L33/56
Inventor P.S.马丁
Owner LUMILEDS HLDG BV