Glass disk forming machine

A molding machine and wafer technology, applied in glass molding, glass production, glass manufacturing equipment, etc., can solve problems such as complex structure, and achieve the effect of simple overall structure, convenient operation, and simple structure

Inactive Publication Date: 2016-02-24
YONGDING YIXIN MACHINERY MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the disadvantages of relatively complicated structure in the prior art, the present invention provides a glass wafer forming machine with relatively simple structure

Method used

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  • Glass disk forming machine
  • Glass disk forming machine

Examples

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Embodiment

[0028] Glass wafer forming machines, such as Figure 1 to Figure 9 As shown, it includes a base 1, a disc 2 is rotatably connected to the base 1, a feed delivery device 3 for transporting semi-condensed glass melt 34, a scraper device 4 for scraping off residual glass, The lower part of the base 1 is located below the disc 2 and is provided with a sloping plate 52 through which the formed glass wafer can enter the next process.

[0029] The circumferential surface of the disk 2 is provided with an annular trough 5, and the outer side of the disk 2 is provided with a plurality of mold units arranged in a ring; The thimble 26 on the other side of the disc 2, the die 15 that is arranged on the side wall of the annular trough 5; one end of the punch 23 stretches out from the disc 2, and the other end of the punch 23 is aligned with the die 15; one end of the thimble 26 extends Out of the disc 2, the other end of the thimble 26 extends into the die 15; the base 1 is provided with ...

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PUM

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Abstract

The invention relates to a glass forming machine and discloses a glass disk forming machine. The glass disk forming machine comprises a base, a disc is rotatingly connected to the base, the circumferential surface of the disc is provided with an annular material groove, the outer side of the disc is provided with a plurality of mold units arranged in an annular way, the mold unit comprises a punching pin slidingly sleeved by one side of the disc, an ejector pin slidingly sleeved by the other side of the disc and a female mold arranged at the side wall of the annular material groove, one end of the punching pin stretches out of the disc, the other end of the punching pin aligns at the female mold, one end of the ejector pin stretches out of the disc, the other end of the ejector pin stretches into the female mold, the base corresponding to the punching pin is provided with a first guide plate capable of extruding the punching pin, and the base corresponding to the ejector pin is provided with a second guide plate capable of extruding the ejector pin. The glass disk forming machine has a simple structure. The punching pin is guided by the first guide plate to be inserted into the female mold, simultaneously, semi-solid glass melt in the annular material groove is poured into the female mold, and after the glass disc is molded and cooled, the ejector pin is guided by the second guide plate to go through the female mold so that the molded glass disc is pushed out of the female mold by the ejector pin.

Description

technical field [0001] The invention relates to glass forming equipment, in particular to a glass wafer forming machine. Background technique [0002] At present, the existing glass wafer forming machine has a relatively complex structure, high manufacturing cost, difficult operation, and the thickness of the glass wafer cannot be adjusted according to the needs, and the residual glass will easily affect the quality of subsequent products. In addition, in the production of existing glass wafers, the equipment for the glass melting process and the forming process are set together, and the melted glass is directly transported to the forming machine internally, which is easily limited by the site and cannot be used on a large scale. The glass melting process and the glass wafer forming process are carried out in a timely manner; and if there is a problem in one process, the entire process will be stopped, affecting production efficiency. Therefore the researcher proposes the r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B19/00
CPCY02P40/57
Inventor 钟小明
Owner YONGDING YIXIN MACHINERY MFG
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