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Targets for reactive sputter deposition of electrically insulating layers

A sputter deposition, electrical insulating layer technology, applied in sputter plating, coatings, circuits, etc., can solve problems such as process instability

Active Publication Date: 2017-11-17
OERLIKON SURFACE SOLUTIONS AG PFAFFIKON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] The object of the present invention is to provide a solution that avoids process instabilities that can occur due to spark discharges between target and anode during the deposition of an electrically insulating layer by means of a reactive sputtering process

Method used

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  • Targets for reactive sputter deposition of electrically insulating layers
  • Targets for reactive sputter deposition of electrically insulating layers
  • Targets for reactive sputter deposition of electrically insulating layers

Examples

Experimental program
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Embodiment Construction

[0022] Targets according to the invention such as figure 1 shown schematically and includes at least one first region B at least within the surface region 10 M1 and a second region B M2 ,in,

[0023] ·The first area B M1 From the first material M 1 Composed, the first material is composed of one or more elements, these elements can react with the reaction gas in such a way that the reaction generated by the reaction contains M 1 The composite material corresponds to the composition of the layer film material desired for coating the substrate to be coated, and

[0024] ·Second area B M2 by the second material M 2 Composition, the second material is composed of one or more elements, these elements are inert with respect to the above-mentioned reaction gas, or can react with the above-mentioned reaction gas in such a way, that is, the inclusion M caused by the reaction 2 The composite material has a higher ratio than containing M 1 higher electrical conductivity of the co...

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PUM

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Abstract

The invention relates to a target whose target surface is configured in such a way that by using said target for reactive sputter deposition of an electrically insulating layer in a coating chamber, the generation of spark discharges on the target surface to an anode also located in the coating chamber is avoided.

Description

technical field [0001] The invention relates to a target whose target surface is configured in such a way that spark discharges from the target surface to the anode (also located in the coating chamber) are avoided by using the target for the reactive sputter deposition of an electrically insulating layer in the coating chamber. Background technique [0002] Coating processes using sputtering technology (hereinafter also terms such as sputtering process, HIPIMS process and sputter deposition, wherein all these processes are considered coating processes using sputtering technology) use at least one This is done in the case of a so-called target which is connected as a cathode by applying a negative voltage with a voltage or power source. During the sputtering process, at least one additional electrode, which is also located in the coating chamber, is connected as an anode. A so-called working gas, generally an inert gas, is fed into the coating chamber and positively charged...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/08C23C14/34C23C14/00C23C14/35H01J37/34
CPCH01J37/3467C23C14/0036C23C14/081C23C14/3407C23C14/3485C23C14/35H01J37/3417H01J37/3423H01J37/3429H01J2237/3321H01J2237/3322
Inventor 约格·哈克曼西格弗里德·克拉斯尼策尔
Owner OERLIKON SURFACE SOLUTIONS AG PFAFFIKON