Control device and method for monitoring the function of semiconductor components during their operation and electrical structural assembly with control device

Abstract

A control device (2) is proposed for monitoring the function of semiconductor components (18a, b) during their operation, comprising an input port (4) and an evaluation device (6), the input port being designed to receive A sensor signal (12) corresponding to a contactless determined temperature distribution on the surface of the semiconductor component (18a, b), the evaluation device being designed to determine whether the temperature distribution is based on the sensor signal (12) Predetermined criteria are fulfilled, which corresponds to the operation of the semiconductor components (18a, b) not in a normal operating state. The output port (8) is designed to output an emergency signal (10) when a decision criterion is met, wherein the emergency signal (10) leads to the implementation of emergency measures.

Description

technical field [0001] Embodiments relate to control devices and methods for monitoring the function of semiconductor components during their operation. Background technique [0002] The applications in which the function of semiconductor components should be monitored during their operation are diverse. For example, when semiconductor components such as power semiconductors are operated at high temperatures, these power semiconductors age faster. The aging of power semiconductors, in addition to causing their damage, may also lead to a shift in the characteristic curves of semiconductor components, so that due to aging effects these components may not operate under ideal technical conditions, and in this case It was not found. With regard to the durability of electrical structural components using semiconductor components or power semiconductors such as insulated gate bipolar transistors (IGBTs), it is desirable to monitor the function of the semiconductor components used...

AI Technical Summary

Problems solved by technology

This means that possible emergency measures cannot be taken with the required accuracy if aging or a strong temperature rise does not occur at the location of the thermocouple

It is to be noted here that even when the theoretical model might predict the maximum temperature rise occurring on the semiconductor component for the semiconductor observed in isolation, this location varies greatly due to the different loading situations already indicated above, so that it cannot Ensure reliability using thermocouples for any configuration

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