Semiconductor device including temperature sensing circuit

A temperature sensing circuit and temperature sensing technology, applied in the testing of single semiconductor devices, parts of thermometers, thermometers, etc., can solve the problems of difficulty, temperature information output devices occupying a large area, etc.

Inactive Publication Date: 2021-05-21
SK HYNIX INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it is not easy to apply a temperature information output device within a limited area of ​​a memory device since the temperature information output device occupies a relatively large area.

Method used

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  • Semiconductor device including temperature sensing circuit
  • Semiconductor device including temperature sensing circuit
  • Semiconductor device including temperature sensing circuit

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Embodiment Construction

[0018] Embodiments are described in more detail below with reference to the accompanying drawings. However, this invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Throughout this disclosure, like reference numerals refer to like parts in the various figures and embodiments of the invention. In addition, throughout this specification, references to "one embodiment" etc. are not necessarily to only one embodiment, and different references to any such phrase are not necessarily to the same embodiment.

[0019] Throughout the specification, when an element is referred to as being "connected" or "coupled" to another element, it may mean that the former element is directly connected or coupled to the latter element or with an intervening one o...

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Abstract

A semiconductor device includes a control signal generation circuit configured to shift a test mode signal in response to a clock signal to generate a plurality of control signals, and a plurality of temperature sensing circuits each including a first resistor having a resistance that varies depending on temperature and configured to generate a temperature sensing signal based on the resistance in response to a corresponding control signal of the plurality of control signals.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2019-0150219 filed on November 21, 2019, the entire contents of which are hereby incorporated by reference. technical field [0003] Various embodiments relate to a semiconductor device having a temperature sensing circuit, and more particularly, to a semiconductor device capable of effectively sensing a plurality of regions by using a temperature sensing circuit having a simple structure and an operating method thereof temperature. Background technique [0004] Various semiconductor devices, such as CPUs, memories, and gate arrays, implemented in integrated chips, are incorporated and used in various consumer or industrial electronic devices, such as computers, mobile phones, portable digital assistants (PDAs), digital cameras, games computers, servers, and workstations. The semiconductor memory may be a volatile memory device such as static RAM ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C11/406
CPCG11C11/40626G01K1/026G01K7/20G11C29/028G11C29/12015G01K7/22G01K7/021G01J5/0007G01K3/005G01R27/00G01R31/00G01R31/26G01R31/2607G01R31/2851G01R31/2874
Inventor 金多厚李钟天
Owner SK HYNIX INC
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