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Manufacturing method of chip resistor

A chip resistor and manufacturing method technology, applied in the direction of resistor manufacturing, resistors, trimmer resistors, etc., can solve the problems of declining yield and easy distortion of the shape of the dividing surface.

Active Publication Date: 2018-04-10
KAO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At that time, if the large substrate or long substrate cannot be broken neatly along the division groove, the shape of the division surface that becomes the end surface of the chip resistor will easily become distorted, so the manufacturing yield will decrease.

Method used

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  • Manufacturing method of chip resistor
  • Manufacturing method of chip resistor
  • Manufacturing method of chip resistor

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Experimental program
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Embodiment Construction

[0025] Hereinafter, embodiments of the invention will be described with reference to the drawings. Such as figure 1 and figure 2 As shown, the chip resistor (chip-resistor) 1 of the present invention is mainly composed of a cuboid-shaped insulating substrate 2, which is arranged on the front side of the insulating substrate 2 (in figure 2 A pair of front electrodes 3 at both ends of the longitudinal direction in the center are the upper surface), and are arranged on the back surface of the insulating substrate 2 (in figure 2 middle is the lower surface), a pair of back electrodes 4 at both ends in the longitudinal direction, a resistor 5 at both ends overlapping with a pair of front electrodes 3 and provided on the front surface of the insulating substrate 2, an inner coating 6 covering the resistor 5, Outer coat 7 covering inner coat 6, a pair of end electrodes 8 bridging front electrode 3 and back electrode 4, and a plating layer covering a part of each front electrode ...

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Abstract

Provided is a method of manufacturing a chip resistor capable of suppressing generation of chips at intersections of primary division grooves and secondary division grooves. When a first-level division groove (21) with concave-convex depth is formed on one side of the large substrate (20), and a plurality of pairs of front electrodes (3) straddling the first-level division groove (21) and across After the resistors (5) etc. on the paired front electrodes (3), place the large substrate (20) along a The stage division groove (21) divides into one stage, so as to obtain a plurality of strip-shaped substrates (30) from the large substrate (20). When performing the first-level division, the first-level division groove (21) starts to split from the area where the electrode is formed with a small depth of the groove and has strength, and then the intersecting part with a large depth of the groove and is fragile is divided, so the strength can be adjusted. The one-stage division is performed with a large load applied to the low staggered portion, and generation of debris (chips) at the staggered portion can be prevented.

Description

technical field [0001] The present invention relates to a method for manufacturing a chip resistor obtained by dividing a sheet-like large substrate along horizontal and vertical dividing grooves. Background technique [0002] A chip resistor is mainly composed of a rectangular insulating substrate in plan view, a pair of electrode parts provided on the insulating substrate at a predetermined interval, a resistor that bridges the paired electrode parts, and an insulating protective coating covering the resistor. A rest groove for adjusting the resistance value is formed on the resistor. The electrode portion is composed of a front electrode, a back electrode, and an end electrode bridging the two electrodes, and the pair of front electrodes are bridged by a resistor on the front side of the insulating substrate. [0003] Usually, in the case of manufacturing such a chip resistor, a plurality of primary and secondary dividing grooves extending horizontally and vertically are...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C17/06
CPCH01C17/006H01C17/06H01C17/22H01C17/242H01C17/28
Inventor 竹上裕也上兼藤太郎松本健太郎
Owner KAO CORP