Carbon fiber plate and electronic device

A carbon fiber board, carbon fiber technology, applied in the direction of electronic equipment, electrical equipment shell/cabinet/drawer, electrical components, etc., can solve the problem of difficult to meet users' requirements for light and thin electronic equipment, large thickness and weight, etc., to improve rigidity , the effect of reducing thickness and weight

Inactive Publication Date: 2016-03-23
LENOVO (BEIJING) CO LTD
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  • Abstract
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  • Application Information

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Problems solved by technology

However, the density of the existing carbon fiber board is close to that of commonly used metal housings such as aluminum-magnesium alloy housings. However, in order to meet the rigidity requirements of electronic

Method used

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  • Carbon fiber plate and electronic device

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Embodiment Construction

[0024] The embodiment of the present invention discloses a carbon fiber board, the middle layer adopts non-wetting non-woven fabric structure layer, and the carbon fiber arrangement directions of the two adjacent carbon fiber layers in the carbon fiber layer groups on both sides are respectively perpendicular to each other, so that the carbon fiber board The rigidity of the carbon fiber board is improved, which can not only meet the rigidity requirements of electronic equipment, but also set the thickness range of the carbon fiber board to 0.7mm-0.9mm, which not only reduces the thickness and weight of the carbon fiber board, but also facilitates the application of carbon fiber boards. The electronic equipment of the casing realizes thinning and lightening. The embodiment of the present invention also discloses an electronic device, which uses the casing made of the above-mentioned carbon fiber board. The rigidity of the casing can meet the requirements of use, and the casing i...

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Abstract

The invention discloses a carbon fiber plate. The carbon fiber plate comprises a first carbon fiber layer set, a middle layer and a second carbon fiber layer set. The middle layer is clamped between the first carbon fiber layer set and the second carbon fiber layer set and is a non-immersed non-woven fabric structural layer. The arrangement directions of carbon fibers of every two adjacent carbon fiber layers in each carbon fiber layer set are perpendicular to each other. The rigidity of the carbon fiber plate can be improved, the thickness of the carbon fiber plate can be reduced on the basis that the requirement of an electronic device for the rigidity of a shell made of the carbon fiber plate is met, the thickness can be set to range from 0.7 mm to 0.9 mm, the thickness and the weight of the carbon fiber plate can be reduced, and light weight and thinning of the electronic device with the shell made of the carbon fiber plate can be achieved. The invention further discloses the electronic device. The shell of the electronic device is made of the carbon fiber plate. The rigidity of the shell can meet use requirements; in addition, the shell is small in thickness and weight, and the requirements of a user for light weight and thinning of the electronic device can be met.

Description

technical field [0001] The invention relates to the technical field of machinery industry, more specifically, to a carbon fiber board, and also to an electronic device. Background technique [0002] With the development of society, electronic equipment is more and more widely used in people's production and life. An electronic device includes a housing and electronic components disposed in the housing. [0003] At present, more and more carbon fiber plates are used in the housing of electronic equipment to meet the needs of customers. However, the density of the existing carbon fiber board is close to that of commonly used metal housings such as aluminum-magnesium alloy housings. However, in order to meet the rigidity requirements of electronic equipment for the housing, the carbon fiber board needs to be set to more than 1.2mm, resulting in a large thickness and weight. It is difficult to meet users' requirements for thinner and lighter electronic equipment. [0004] To ...

Claims

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Application Information

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IPC IPC(8): B32B5/26B32B5/02B32B9/00B32B5/12B32B33/00H05K5/00
CPCH05K5/00B32B5/022B32B5/12B32B5/26B32B9/007B32B33/00B32B2250/20B32B2262/106B32B2307/718B32B2457/00
Inventor 郝宁尤德涛张强马映峰杨帆
Owner LENOVO (BEIJING) CO LTD
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