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A highly sensitive fluid temperature sensor and its manufacturing method

A technology of fluid temperature and production method, which is applied to thermometers, thermometers with directly heat-sensitive electric/magnetic elements, instruments, etc., can solve the problem that the reaction speed cannot meet the requirements of high sensitivity of temperature detection, poor thermal conductivity, and low thermal conductivity. Advanced problems, to achieve the effect of protecting thermistor, high pass rate and high thermal conductivity

Active Publication Date: 2018-07-06
ZHAOQING EXSENSE ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] The above-mentioned NTC temperature sensor has the following disadvantages: (1) because the thickness of the thermosensitive chip 16 is relatively thick, usually 0.3 to 3mm, and the thickness of the outer insulating encapsulation layer 17 (generally epoxy resin, phenolic resin, silicone resin) is also relatively thick. Thick and poor thermal conductivity; (2) Filling resin 12 (generally epoxy, phenolic, silicone, thermal conductivity grease / glue and other materials) its thermal conductivity is not high
This reaction speed cannot meet the requirements for high sensitivity of temperature detection

Method used

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  • A highly sensitive fluid temperature sensor and its manufacturing method
  • A highly sensitive fluid temperature sensor and its manufacturing method
  • A highly sensitive fluid temperature sensor and its manufacturing method

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Embodiment Construction

[0040] see figure 2 , which is a schematic structural view of the high-sensitivity fluid temperature sensor of the present invention; the high-sensitivity fluid temperature sensor of the present invention includes a housing 1, a thermistor 2, and an electronic wire 5 connected to the lead wire of the thermistor 2; the housing 1 sets Set outside thermistor 2.

[0041] Specifically, the thermistor 2 is packaged in glass, and its glass wrapping layer is in the shape of a multi-section gourd; one end of the housing 1 is a comb-shaped structure 110, and the end of the thermistor 2 with the glass wrapping layer is fixed on The comb-shaped structure 110 is partially exposed to the housing 1 through the comb-tooth gaps of the comb-shaped structure 110; the space between the housing 1 and the thermistor 2 is filled with potting material or injection molding material 4, The potting compound can be made of materials such as epoxy resin. The welding part of the thermistor 2 and the ele...

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Abstract

The invention discloses a high-sensitivity fluid temperature sensor, and the sensor comprises a thermistor, an electronic wire connected with a lead of the thermistor, and a housing sleeving the exterior of the thermistor. The thermistor is packaged through glass, and the glass wrapping layer is shaped like a multi-section cucurbit. One end of the housing is in a comb-tooth shaped structure, and one end, equipped with the glass wrapping layer, of the thermistor is fixed in the comb-tooth shaped structure, and is exposed out of the housing through all comb-tooth gaps of the comb-tooth shaped structure. The space between the housing and the thermistor is filled with potting materials or injection molding materials. The sensor is high in reaction speed, is resistant to high temperature, is resistant to moisture, and is high in mechanical strength. The invention also provides a manufacturing method for the sensor.

Description

technical field [0001] The invention belongs to the field of electronic components, in particular to a high-sensitivity fluid temperature sensor and a manufacturing method thereof. Background technique [0002] Thermistors and temperature sensors, which use thermal chips as the core components and adopt different packaging forms, are widely used in various temperature detection, temperature compensation, and temperature control circuits. The central role of electronic signaling. [0003] With the development of electronic technology, all kinds of electronics are further multi-functional and intelligent, and the application of thermal-sensitive chips in various occasions that need to detect, control, and compensate temperature is increasing. Due to the sensitivity of temperature detection and high temperature requirements, higher and higher requirements are put forward for the response speed and high temperature resistance of temperature sensors, which requires the thermal t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K7/16
CPCG01K7/16
Inventor 程文龙段兆祥杨俊唐黎明柏琪星
Owner ZHAOQING EXSENSE ELECTRONICS TECH