Light-emitting diode device and lighting lamp containing same
A technology for light-emitting diodes and substrates, which is applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of heat accumulation of light-emitting diodes, affecting luminous efficiency and service life, and achieves the improvement of heat dissipation effect, brightness and service life. Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 example
[0027] refer to figure 1 , is the first embodiment of the light emitting diode device 100 of the present invention. Here, the LED device 100 includes a heat dissipation substrate 1 , a power supply substrate 2 and a LED die 3 .
[0028] The heat dissipation substrate 1 is made of a material with a high thermal conductivity, which can conduct the heat generated by the LED die 3 to the outside, so as to avoid the problem of heat accumulation. In this embodiment, the heat dissipation substrate 1 is made of metal and other materials, but the specific material selection is not limited to metal.
[0029] The power supply substrate 2 is disposed on the heat dissipation substrate 1 and includes a transparent plate 21 , a conductive circuit 22 and a reflective layer 23 .
[0030] The light-transmitting plate 21 is made of transparent and insulating material, on which the LED die 3 is disposed. In this embodiment, the material of the light-transmitting plate 21 is selected from boron...
no. 2 example
[0038] refer to figure 2 , is the second embodiment of the light emitting diode device 100 of the present invention. Compared with the first embodiment, the LED device 100 of this embodiment further includes a fluorescent structure 4 and a lens structure 5 , and the power supply substrate 2 is not provided with a reflective layer.
[0039] The fluorescent structure 4 can adjust the light color of the light emitting diode device 100 , it is disposed on the power supply substrate 2 , and includes a first fluorescent body 41 and a second fluorescent body 42 . The first phosphor 41 is disposed between the power supply substrate 2 and the LED die 3 , and is fabricated by printing, dispensing and other techniques before the LED die 3 is mounted on the power supply substrate 2 . The second phosphor 42 wraps the LED die 3 inside, which is manufactured after the LED die 3 is mounted on the power supply substrate 2 . In this embodiment, since the first phosphor 41 cooperates with the...
no. 3 example
[0043] refer to image 3 , is the third embodiment of the light emitting diode device 100 of the present invention. Compared with the first embodiment, the light-emitting diode device 100 of this embodiment includes a plurality of power supply substrates 2 and a plurality of light-emitting diode chips 3, and the power supply substrates 2 are respectively installed on two opposite sides of the heat dissipation substrate 1 to emit light. The diode chips 3 are respectively disposed on the power supply substrate 2 . Accordingly, in the first embodiment, the half-period light output characteristic of the LED device 100 is changed to that of the full-circle light provided by the LED crystal grains 3 located on the upper and lower sides of the heat dissipation substrate 1 in this embodiment. Light characteristics.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More