Manufacturing method of printed circuit board solder-resist plug hole structure, and printed circuit board
A technology for printed circuit boards and manufacturing methods, which is applied in the directions of printed circuit components, the formation of electrical connection of printed components, and the electrical connection of printed components, etc., can solve the problems of open circuits in dense lines, no metal in via holes, etc.
Active Publication Date: 2016-03-30
SHENNAN CIRCUITS
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[0004] Embodiments of the present invention provide a method for manufacturing a printed circuit board solder-resisting plug hole structure and a printed circuit board, which can solve the problems of open circuits in dense lines and open circuits due to the absence of metal in the via holes
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[0045] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.
[0046] The terms "first", "second", "third" and "fourth" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily to describe a specific order or sequentially. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the e...
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Abstract
The embodiment of the invention discloses a manufacturing method of a printed circuit board solder-resist plug hole structure, and a printed circuit board. The manufacturing method comprises the steps of: acquiring the printed circuit board after completing inner layer graph manufacturing and press-fit operation, and forming a via hole in a solder-resist region on an outer layer copper foil of the printed circuit board; filling the via hole with solder-resist ink after plating a metal layer on the hole wall of the via hole; baking the via hole filled with the solder-resist ink in a segmented manner for curing under preset temperature and time conditions; forming openings in portholes on both ends of the via hole filled with the solder-resist ink; and printing resin at the portholes on both ends of the via hole. The manufacturing method can solve the problems of open circuit of dense lines and open circuit of the via hole due to inexistence of metal therein.
Description
technical field [0001] The invention relates to the field of PCB (Printed circuit board) printed circuit board manufacturing, in particular to a method for manufacturing a printed circuit board solder resist plug hole structure and a printed circuit board. Background technique [0002] As the design of electronic products becomes more and more complicated, the wiring of PCB boards becomes more dense. The via hole penetrates to the component surface to cause a short circuit, so the green oil plug hole is introduced into the PCB board into the manufacturing process to solve the problem of flux residue in the via hole during the soldering process of electronic components and the pop-up of tin beads during reflow soldering of the PCB board caused by the short circuit problem. [0003] In the prior art, the process of plugging holes with solder resist green oil generally adopts the process of plugging holes with green oil after electroplating the metal layer, curing, removing ex...
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Login to View More IPC IPC(8): H05K1/11H05K3/40
Inventor 刘宝林黄立球沙雷
Owner SHENNAN CIRCUITS