A kind of LED light source and packaging method thereof

Abstract

The invention relates to a light emitting diode (LED) light source and a package method thereof. More than three solid crystal regions are arranged in a light emitting region on a cooling plate, mirror surface layers are arranged on the surfaces of the solid crystal regions, LED chips are pasted on the solid crystal regions, the LED chips in the same solid crystal region are connected in series through a gold line to form an LED series circuit, bonding pads are arranged at the two ends of each solid crystal region, the two ends of the LED series circuit are connected with the bonding pads at the two ends through gold lines, a positive electrode bonding pad and a negative electrode bonding pad, arranged at intervals, of each solid crystal region are connected via a lead line so that the LED series circuit on different solid crystal regions are connected in series to form light source control circuits, and fluorescent adhesive layers with same color temperature are arranged on the solid crystal region of the same light source control circuit. Two colors of light source control circuits can be arranged in the light emitting region, such light source control circuits are independent circuits, and light sources can be mixed by controlling light with two types of color temperatures; and each solid crystal region of the LED light source is provided with the mirror surface layer, a mirror surface has a good reflection effect, and thus, the luminous efficiency of an LED can be improved.

Description

technical field [0001] The invention relates to the field of LED lighting, in particular to an LED light source and a packaging method thereof. Background technique [0002] The LED light source generates a lot of heat, so it is necessary to solve the problem of heat dissipation. Thermoelectric separation is undoubtedly one of the ways to solve the problem of heat generation of the LED light source. However, the structure of some LED light sources is not suitable for thermoelectric separation. For example, the control circuit that needs to control the light emission of two colors of LEDs is generally made on the aluminum substrate to form a circuit layer, and the LED chip is fixed on the circuit layer. The heat of the chip is transferred to the aluminum substrate through the circuit layer for heat dissipation. This kind of light source structure has poor heat dissipation efficiency, so the power of the LED light source cannot be done too well, which limits the application ra...

AI Technical Summary

Problems solved by technology

However, the structure of some LED light sources is not suitable for thermoelectric separation. For example, the control circuit that needs to control the light emission of two colors of LEDs is generally made on the aluminum substrate to form a circuit layer, and the LED chip is fixed on the circuit layer. The heat of the chip is transferred to the aluminum substrate through the circuit layer for heat dissipation. This kind of light source structure has poor heat dissipation efficiency, so the power of the LED light source cannot be done too well, which limits the application range of the light source.

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