Check patentability & draft patents in minutes with Patsnap Eureka AI!

Method of partial opening of copper window in multi-layer flexible printed circuit board

A printed circuit board, flexible technology, applied in printed circuit, printed circuit manufacturing, removal of conductive materials by chemical/electrolytic methods, etc. The effect of avoiding the penetration of the potion and reducing the risk of product scrapping

Active Publication Date: 2018-07-13
CHUNHUA TECHNOLOGICAL KUSN
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The first method mentioned above needs to strictly control the laser cutting parameters during cutting, and there is a risk of cutting into the middle layer of the circuit board; while the second method has the risk of liquid infiltration from the cutting line during the wet process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method of partial opening of copper window in multi-layer flexible printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Embodiment 1: A multilayer flexible printed circuit board is formed by combining and superimposing multilayer structures, and the copper foil substrate 1 constituting its top or bottom surface is composed of a copper layer and a PI layer. According to design requirements, copper windows need to be opened on the two layers of copper foil substrates 1 .

[0012] See attached figure 1 shown. A method for partially opening copper windows on a multilayer flexible printed circuit board includes two parts.

[0013] 1. Before combining the multilayer structure, the PI layer of the copper foil substrate 1 used to form the top or bottom surface of the flexible printed circuit board is cut along the edge of the required copper window to form a cutting line by laser method. Keep its copper layer.

[0014] After cutting the PI layer, it is combined with other laminates to form a multi-layer flexible printed circuit board, and then the outer layer circuit is made. During the wet ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a local conformal mask method for a multi-layer flexible printed circuit board, which is used for forming a conformal mask structure on the flexible printed circuit board formed by combination of a multi-layer structure. The method comprises the following steps: before combining the multi-layer structure, cutting a PI layer of a copper foil base material for forming the top surface or the bottom surface of the flexible printed circuit board along the edge of a to-be-formed conformal mask by a laser method and reserving a copper layer; and after combining and forming the flexible printed circuit board, etching away the copper layer of the copper foil base material for forming the top surface or the bottom surface of the flexible printed circuit board on the conformal mask, and removing the PI layer at the position of the conformal mask. The local conformal mask of the multi-layer flexible printed circuit board is formed by the method of cutting the PI layer before combination and etching the copper layer after combination, so that the damage to a line can be avoided; penetration of a liquid medicine in a wet process can also be avoided; and the product scrap risk is lowered.

Description

technical field [0001] The invention relates to a method for opening copper windows on a multilayer flexible printed circuit. Background technique [0002] The multilayer flexible printed circuit board is composed of a multilayer structure, wherein the copper foil base material forming its top or bottom surface is composed of a copper layer and a PI layer. In the partial double-sided design of the multilayer flexible printed circuit board, it is necessary to remove the copper foil base material forming the top or bottom surface of the multilayer board in the local area to form a copper window. At present, there are mainly two methods of opening copper windows: 1. After forming a multi-layer flexible printed circuit board, that is, after the circuit board circuit is formed, the copper foil substrate on the top or bottom surface is formed by laser cutting technology. Remove; 2. Pre-cut with a knife die pre-moving cutting line to form the edge of the copper window and then ass...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06
CPCH05K3/06H05K2203/0338
Inventor 马睿骏邱文炳莫卫龚邓坤
Owner CHUNHUA TECHNOLOGICAL KUSN
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com