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Flexible and hard combined circuit board and manufacturing method thereof

A soft-rigid combination and production method technology, which is applied in the directions of printed circuit components, structural connection of printed circuits, and assembly of printed circuits with electrical components, which can solve problems such as unfavorable soft-rigid combination circuit boards. effect of time

Inactive Publication Date: 2016-04-06
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the production process of the traditional rigid-flex circuit board, the flexible circuit board in the window area is easily bonded to the outer layer during the lamination step, which is not conducive to the subsequent opening of the rigid-flex circuit board.

Method used

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  • Flexible and hard combined circuit board and manufacturing method thereof
  • Flexible and hard combined circuit board and manufacturing method thereof
  • Flexible and hard combined circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The manufacturing method of the soft-rigid circuit board provided by the technical solution includes the following steps:

[0021] For a first step, see figure 1 , providing a flexible circuit board 110 .

[0022] The flexible circuit board 110 can be a single-sided circuit board or a double-sided circuit board. In this embodiment, the flexible printed circuit board 110 is taken as an example for illustration. The flexible circuit board 110 includes an insulating layer 111 , first conductive circuit layers 112 formed on opposite sides of the insulating layer 111 , and first covering films 113 respectively formed on surfaces of the two first conductive circuit layers 112 . The flexible circuit board 110 includes a flexible area 114 and a fixing area 115 connected to opposite sides of the flexible area 114 . The flexible area 114 corresponds to the bending area forming the rigid-flex circuit board. The first conductive circuit layer 112 is both distributed in the flex...

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PUM

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Abstract

The invention relates to a manufacturing method of a flexible and hard combined circuit board. The method comprises the steps that a flexible circuit board including a first conducting circuit layer is provided, the flexible circuit board comprises a flexible area, and the surface of the first conducting circuit layer is coated with a first cover membrane; films and second cover membranes are provided, each film is internally provided with a first opening corresponding to the flexible area, and each second cover membrane comprises a membrane layer and a glue layer; enhanced layer plates are provided, and a windowing area corresponding to the flexible area is defined in each enhanced layer plate; the enhanced layer plate, the second cover membrane, the film, the flexible circuit board, the film, the second cover membrane and the enhanced layer plate are stacked and laminated successively so that the glue layers of the second cover membranes are bonded to the enhanced layer plates respectively, and the flexible area, the first opening and the bonding area are in one to one correspondence; and the enhanced layer plates and the second cover membranes corresponding to the flexible areas are removed to expose the flexible circuit board corresponding to the flexible area, and the flexible and hard combined circuit board is thus formed.

Description

technical field [0001] The invention relates to the field of circuit boards and their manufacture, in particular to a soft-rigid circuit board and a manufacturing method thereof. Background technique [0002] The rigid-flex circuit board is a circuit board structure including interconnected flexible boards and rigid boards, which can not only have the flexibility of a flexible circuit board, but also have the hardness of a rigid board. During the production process of the traditional rigid-flex circuit board, the flexible circuit board in the window area is easily bonded to the outer layer during the lamination step, which is not conducive to the subsequent opening process of the rigid-flex circuit board. Contents of the invention [0003] In view of this, it is necessary to provide a method for manufacturing a rigid-flex circuit board that overcomes the above-mentioned problems. [0004] A method for manufacturing a rigid-flex circuit board, comprising the steps of: prov...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/36H05K1/14
Inventor 李卫祥
Owner AVARY HLDG (SHENZHEN) CO LTD
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