Terminal cooling device and mobile terminal

A heat dissipation device and terminal technology, applied in the field of communication, to achieve the effect of accelerating heat dissipation and quickly conducting heat to heat pipes

Inactive Publication Date: 2016-04-06
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention provides a terminal cooling device and a mobile terminal to at least solve the problem in the related art that the heat cannot be quickly transferred to the heat pipe due to the back and forth transformation of the conduction medium on the heat conduction path

Method used

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  • Terminal cooling device and mobile terminal
  • Terminal cooling device and mobile terminal
  • Terminal cooling device and mobile terminal

Examples

Experimental program
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Embodiment Construction

[0030] Hereinafter, the present invention will be described in detail with reference to the drawings and examples. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0031] In this embodiment, a terminal cooling device is provided, figure 1 is a schematic diagram of a terminal cooling device according to an embodiment of the present invention, such as figure 1 As shown, the device includes: a heat source chip, a heat pipe, and a shield, wherein the shield is located between the heat source chip and the heat pipe, and is connected to the heat source chip and the heat pipe through the same elastic heat-conducting solid. A microhole array is arranged at the joint of the elastic heat-conducting solid.

[0032] As a preferred embodiment, a microhole array is provided at the connection where the shield contacts the elastic heat-conducting solid, wherein the microhole...

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PUM

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Abstract

The invention discloses a terminal cooling device and a mobile terminal. The terminal cooling device comprises a heat source chip, a heat pipe, and a shielding cover, wherein the shielding cover is located between the heat source chip and the heat pipe and is connected with the heat source chip and the heat pipe via the same elastic heat conducting solid; and a micropore array is arranged at the place where the shielding cover and the elastic heat conducting solid are connected. Thus, the problem that heat can not be quickly conducted to the heat pipe as a conducting medium on the heat conducting path is transformed back and forth in the related technology can be solved, the heat can be quickly conducted to the heat conducting pipe, and the cooling effect is quickened.

Description

technical field [0001] The present invention relates to the communication field, in particular to a terminal cooling device and a mobile terminal. Background technique [0002] The main frequency of the core processor of the smart mobile terminal is continuously increasing from 1GHz to 2GHz, and dual-core, quad-core and even eight-core become the norm; LCD (Liquid Crystal Display, referred to as LCD) screens increase in resolution from FHD (1920*1080) to 2K ( 2048x1536) is moving towards 4K (3840*2160), resulting in increasing power consumption; at the same time, terminals are becoming thinner and thinner to meet user needs, making the heat dissipation problem in the narrow space of the terminal housing increasingly prominent. [0003] In related technologies, the heat pipe technology used in personal notebook computers has been introduced into mobile terminals, so that the liquid cooling heat dissipation technology has begun to emerge in the field of smart mobile terminals....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K9/00H01L23/427H04M1/02
CPCG06F1/203G06F1/1637G06F1/1656G06F2200/201G06F1/1675G06F1/206H04W88/02H05K7/20336H05K7/2099H05K9/006
Inventor 张永亮
Owner ZTE CORP
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