Dividing wall type heat exchanger

Abstract

The invention discloses a dividing wall type heat exchanger, comprising a heat exchange core and four covers; the heat exchange core has a solid structure made of a heat-conducting material; a plurality of first through holes and a plurality of second through holes not communicating with the first through holes are formed in the heat exchange core; the first through holes penetrate through two front and back opposite side surfaces of the heat exchange core, while the second through holes penetrate through two left and right opposite side surfaces of the heat exchange core; the four covers corresponding to the four front and back, and left and right side surfaces of the heat exchange core one to one; four sides of each cover are hermetically connected with corresponding side surface of the heat exchange core; a connection port allowing a fluidic working medium to flow in is formed in each cover and each connection port communicates with all the first through holes or the second through holes in the corresponding side surface. The heat exchange core of the dividing wall type heat exchanger has a heat exchange function, and also the characteristics of a heat exchanger body, and is unique in structure, and simple and compact in structure, and therefore, small-volume and low-cost production and manufacture can be realized; especially, the heat exchange core of the dividing wall type heat exchanger is suitable for the microelectronic industry and may produce good economic benefits.

Description

technical field [0001] The invention relates to the technical field of heat exchangers, in particular to a partitioned wall heat exchanger. Background technique [0002] A heat exchanger is a heat exchange device that transfers part of the heat of the hot fluid to the cold fluid so that the temperature of the fluid reaches the index specified in the process, also known as a heat exchanger. As heat transfer equipment, heat exchangers are widely used in many fields of industrial manufacturing. With the rapid development of energy-saving technology, there are more and more types of heat exchangers. [0003] According to the heat transfer principle, heat exchangers can be divided into surface heat exchangers, regenerative heat exchangers, fluid connection indirect heat exchangers and direct contact heat exchangers. Among them, the surface heat exchanger refers to the flow of two fluids with different temperatures in the space separated by the wall, through the heat conduction o...

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Problems solved by technology

[0010] The heat exchangers in the above-mentioned prior art can all provide better heat exchange and transfer functions, but they all need to be formed by interconnecting various parts such as pipe fittings or plate parts. The structure is relatively complicated and the volume is large, which is suitable for traditional industrial Industry application

With the development of modern chip technology and the continuous introduction of 2.5D and 3D packaging technologies, the challenge of chip heat dissipation is becoming increasingly severe. If the structure of the above heat exchanger is adopted and designed as a miniature heat exchanger, it can be applied to the microelectronics industry , it will be difficult to manufacture and assemble due to the miniaturization of various components in the transducer, resulting in problems such as low efficiency and high cost

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