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Optical chip integrated structure

A technology of optical chips and optical regions, applied in the field of optical sensors, can solve problems such as optical path asymmetry and detection signal misjudgment, and achieve the effects of reducing size, improving stability and precision

Active Publication Date: 2016-04-20
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional proximity light sensor used to measure human body signs information, due to its asymmetric optical path, makes it necessary to ensure that the device is in close contact with the human skin during the wearing process, otherwise it will cause misjudgment of the detection signal

Method used

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Embodiment Construction

[0026] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0027] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0028] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0029] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses an optical chip integrated structure. An LED chip comprises a substrate arranged on an optical sensor; the substrate is provided with a first surface and a second surface located on different planes, and a plurality of inclined planes obliquely extending to the second surface from the first surface. The plurality of inclined planes are provided with function layers used as the luminous zones of the LED chip. According to the invention, the LED chip can give out light through the function layers on the plurality of inclined planes, thereby realizing the multi-direction luminous function of a single chip. The LED chip and the optical sensor are integrated, thereby meeting requirements of measuring fields utilizing an approaching light principle for detection; in addition, the LED chip and the optical sensor are distributed in a vertical direction, thereby substantially reducing the size of a whole integrated structure, and improving the stability and precision of optical chip measurement.

Description

technical field [0001] The present invention relates to the field of optical sensors, more specifically, the present invention relates to an integrated structure of an optical chip, in particular to a proximity light sensor chip. Background technique [0002] With the development of smart devices, in order to realize their intelligent functions, more and more sensors are introduced into smart devices, and optical sensors are no exception. In some proximity light sensors, the function of gesture recognition can be realized by a certain algorithm. This kind of proximity light sensor generally includes an optical sensor in the middle and multiple LED chips around the optical sensor. The optical sensor and the LED chips are independent Packaged on a circuit substrate. Due to the limitations of the LED chip structure in the prior art, a certain distance must be reserved between the above-mentioned multiple LED chips and the optical sensor so that the optical sensor can sense the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L23/488H01L23/31
CPCH01L2224/48091H01L2924/10155H01L2924/181H01L2924/00012H01L2924/00014H01L25/16H01L23/3185H01L23/488
Inventor 郑国光方华斌孙艳美
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD