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Integrated structure of an optical chip

An optical chip and optical area technology, applied in the field of optical sensors, can solve the problems of misjudgment of detection signals and asymmetry of optical paths, and achieve the effect of reducing size, improving stability and accuracy

Active Publication Date: 2018-01-19
GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional proximity light sensor used to measure human body signs information, due to its asymmetric optical path, makes it necessary to ensure that the device is in close contact with the human skin during the wearing process, otherwise it will cause misjudgment of the detection signal

Method used

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  • Integrated structure of an optical chip
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  • Integrated structure of an optical chip

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Embodiment Construction

[0026] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0027] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0028] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0029] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses an integrated structure of an optical chip. The LED chip includes a substrate arranged on an optical sensor. The substrate has a first surface and a second surface located in different planes, and an LED chip extending obliquely from the edge of the first surface. to a plurality of inclined surfaces on the second surface; a functional layer serving as a light-emitting area of ​​the LED chip is arranged on the plurality of inclined surfaces. In the integrated structure of the present invention, the LED chip can emit light through the functional layers on the multiple inclined surfaces, realizing the multi-directional light emitting function of a single chip. After the LED chip is integrated with the optical sensor, it can be applied to multiple measurement fields that use the principle of proximity light for detection; and the LED chip and the optical sensor can be distributed in the vertical direction, thereby greatly reducing the size of the entire integrated structure , and can improve the stability and precision of optical chip measurement.

Description

technical field [0001] The present invention relates to the field of optical sensors, more specifically, the present invention relates to an integrated structure of an optical chip, in particular to a proximity light sensor chip. Background technique [0002] With the development of smart devices, in order to realize their intelligent functions, more and more sensors are introduced into smart devices, and optical sensors are no exception. In some proximity light sensors, the function of gesture recognition can be realized by a certain algorithm. This kind of proximity light sensor generally includes an optical sensor in the middle and multiple LED chips around the optical sensor. The optical sensor and the LED chips are independent Packaged on a circuit substrate. Due to the limitations of the LED chip structure in the prior art, a certain distance must be reserved between the above-mentioned multiple LED chips and the optical sensor so that the optical sensor can sense the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/16H01L23/488H01L23/31
CPCH01L2224/48091H01L2924/10155H01L2924/181
Inventor 郑国光方华斌孙艳美
Owner GOERTEK MICROELECTRONICS CO LTD