A device and method for improving the uniformity of electroplating in a VCP electroplating line

Abstract

The invention discloses a device for promoting electroplating uniformity of a VCP electroplating wire. The device comprises an electroplating tank; electroplating medicine water is filled in the electroplating tank; flight plates are arranged above the electroplating tank, and are fixed with fixtures for clamping a circuit board; each flight plate consists of at least three fixtures; adjacent fixtures on every flight plate are electrically connected by leads; and adjacent flight plates are electrically connected by leads. The flight plates and the fixtures adopt main materials of stainless steel, and can conduct electricity. The adjacent fixtures and flight plates are electrically connected by the leads, so that the resistance is reduced, and the electroplating efficiency is improved; and meanwhile, the power supply current is averagely distributed to each fixture, so that the thickness range of an electroplating copper layer is effectively reduced, and the electroplating uniformity of the circuit board is largely enhanced. The invention further discloses a method for promoting electroplating uniformity of the VCP electroplating wire; and based on mutual electric connection of the fixtures, the electroplating voltage and current are adjusted, so that the electroplating uniformity of the circuit board is further promoted.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a device and an electroplating method for improving the electroplating uniformity of a VCP electroplating line. Background technique [0002] The vertical continuous electric production line (Vertical Conveyor Plating, referred to as VCP) is a full-board (primary) copper plating production line that uses a spray copper plating process and a vertical continuous conveying device in the production of printed circuit boards (Printed Circuit Board, referred to as PCB). Compared with the vertical electroplating production line, it occupies a small area and has stable electroplating efficiency; during the electroplating process, the circuit board is clamped on the fixture, and all workpieces are continuously moved from one side of the electroplating tank to the other driven by the moving device. On the other hand, the production conditions of each workpiece ar...

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Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is that in the existing VCP electroplating line, the circuit board fixtures are connected and conducted by stainless steel horizontal frames, and there is no electrical connection between the clamps, while the stainless steel horizontal frames have poor conductivity and low current utilization rate. The non-interconnection between the fixtures makes the current distribution on the circuit board uneven, which eventually leads to uneven thickness of the electroplating layer and low electroplating efficiency. Therefore, a device and method for improving the electroplating uniformity of the VCP electroplating line is proposed.

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