Efficient heat dissipation case

A kind of chassis, high-efficiency technology, applied in the direction of screening casing, chemical industry, instruments, etc., can solve the problems of hardware damage, lack of heat dissipation effect, etc., and achieve excellent heat dissipation effect and good electromagnetic shielding effect

Inactive Publication Date: 2016-05-04
罗嘉妤
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is believed that with the intensification of the homogeneity of chassis products, the computer chassis on the market generally do not have a good heat dissipation effect. The heat is gradually increasing, and the existing chassis does not have a heat dissipation function, which easily damages the internal hardware

Method used

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  • Efficient heat dissipation case
  • Efficient heat dissipation case
  • Efficient heat dissipation case

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Such as Figure 1-2 As shown, a high-efficiency heat dissipation chassis includes a box body 1, a side cover 2, a temperature sensor 3, an electronic switch 4 and an electro-hydraulic rod 5, and the box body 1 is provided with a heat conducting plate 6, a hard disk bracket 7 and a connecting block 8. Air holes 9 and screw holes (not shown) are provided on the heat conduction plate 6, which can facilitate the user to install the main board on the heat conduction plate 6. Both sides of the box body 1 are provided with anti-radiation fabrics 10, so The radiation-proof fabric 10 is connected to the box body 1 by bolts (not shown), the radiation-proof fabric 10 is provided with through holes 11, the side cover 2 is hingedly connected with the box body 1, and the side cover 2 is provided with There is a fan 12, the temperature sensor 3 is embedded in the heat conduction plate 6, the electronic switch 4 is installed on the inner surface of the box body 1, the electro-hydraulic...

Embodiment 2

[0044] Such as Figure 1-2As shown, a high-efficiency heat dissipation chassis includes a box body 1, a side cover 2, a temperature sensor 3, an electronic switch 4 and an electro-hydraulic rod 5, and the box body 1 is provided with a heat conducting plate 6, a hard disk bracket 7 and a connecting block 8. Air holes 9 and screw holes (not shown) are provided on the heat conduction plate 6, which can facilitate the user to install the main board on the heat conduction plate 6. Both sides of the box body 1 are provided with anti-radiation fabrics 10, so The radiation-proof fabric 10 is connected to the box body 1 by bolts (not shown), the radiation-proof fabric 10 is provided with through holes 11, the side cover 2 is hingedly connected with the box body 1, and the side cover 2 is provided with There is a fan 12, the temperature sensor 3 is embedded in the heat conduction plate 6, the electronic switch 4 is installed on the inner surface of the box body 1, the electro-hydraulic ...

Embodiment 3

[0061] Such as Figure 1-2 As shown, a high-efficiency heat dissipation chassis includes a box body 1, a side cover 2, a temperature sensor 3, an electronic switch 4 and an electro-hydraulic rod 5, and the box body 1 is provided with a heat conducting plate 6, a hard disk bracket 7 and a connecting block 8. Air holes 9 and screw holes (not shown) are provided on the heat conduction plate 6, which can facilitate the user to install the main board on the heat conduction plate 6. Both sides of the box body 1 are provided with anti-radiation fabrics 10, so The radiation-proof fabric 10 is connected to the box body 1 by bolts (not shown), the radiation-proof fabric 10 is provided with through holes 11, the side cover 2 is hingedly connected with the box body 1, and the side cover 2 is provided with There is a fan 12, the temperature sensor 3 is embedded in the heat conduction plate 6, the electronic switch 4 is installed on the inner surface of the box body 1, the electro-hydraulic...

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PUM

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Abstract

The invention discloses an efficient heat dissipation case which comprises a case body, side covers, temperature sensors, an electronic switch and electro-hydraulic rods, wherein a heat-conducting plate, a hard disk bracket and a connection block are arranged in the case body; air holes and screw holes are formed in the heat-conducting plate; radiation-proof cloth is arranged on both sides of the case body, and is connected with the case body via bolts; through holes are formed in the radiation-proof cloth; the side covers are hinged to the case body; fans are arranged on the side covers; the temperature sensors are embedded in the heat-conducting plate; the electronic switch is mounted on the inner surface of the case body; the electro-hydraulic rods penetrate the through holes; one end of each electro-hydraulic rod is in rotational connection with the connection block; the other ends of the electro-hydraulic rods are in rotational connection with the side covers. The efficient heat dissipation case is excellent in heat dissipation effect and electromagnetic shielding effect.

Description

technical field [0001] The invention relates to a high-efficiency heat dissipation cabinet. Background technique [0002] As a part of computer accessories, the main function of the chassis is to place and fix various computer accessories, and play a role of support and protection. [0003] Looking at the history of personal computer development, the chassis has been quietly growing behind the hardware stage throughout the hardware development process. Although its development speed is much slower than other major hardware, it has also experienced several major changes. And every change is to adapt to Intel's new system architecture, and to adapt to the ever-changing main hardware, such as CPU, motherboard, graphics card and the like. From the AT frame chassis to the ATX frame chassis, to the BTX frame chassis that Intel introduced later but failed to promote, to the very popular 38-degree chassis today, the internal layout is more reasonable, the heat dissipation effect is...

Claims

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Application Information

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IPC IPC(8): G06F1/20H05K9/00C08L61/06C08L83/04C08L45/00C08K13/02C08K3/04C08K3/28C08K3/34C08K5/54C08K3/24
CPCC08L61/06C08L2203/20C08L2205/03G06F1/20G06F2200/202G06F2200/203H05K9/0007C08L83/04C08L45/00C08K13/02C08K3/04C08K2003/282C08K3/34C08K5/5406C08K3/24Y02P20/10
Inventor 罗嘉妤
Owner 罗嘉妤
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