Base plate structure, adhering method and peeling method of flexible base plate thereof

A flexible substrate and substrate technology, which is applied in chemical instruments and methods, nonlinear optics, and other household appliances, etc., can solve the problems that the flexible substrate is not easy to remove or has glue residue, the flexible substrate is difficult to fix, and the cost is high.

Active Publication Date: 2016-05-04
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the above method has the following defects: 1. The flexible substrate is attached to the carrier substrate with an adhesive. After the device is peeled off, it is not easy to remove the prepared flexible substrate from the carrier substrate or there is glue residue; The raw material of the

Method used

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  • Base plate structure, adhering method and peeling method of flexible base plate thereof
  • Base plate structure, adhering method and peeling method of flexible base plate thereof
  • Base plate structure, adhering method and peeling method of flexible base plate thereof

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Embodiment Construction

[0048] The specific implementation manners of the substrate structure provided in the embodiments of the present invention and the method for attaching and peeling off the flexible substrate thereof will be described in detail below with reference to the accompanying drawings.

[0049] Wherein, the thickness and shape of each film layer in the drawings do not reflect the real scale of the substrate structure, and the purpose is only to illustrate the content of the present invention.

[0050] Embodiments of the present invention provide a substrate structure, such as Figure 1 to Figure 3 As shown, it includes: a carrier substrate 1, a flexible substrate 2 arranged on the carrier substrate 1, wherein the carrier substrate can be a rigid glass substrate, and also includes:

[0051] one or more side-by-side adhesive layers 3 sandwiched between the carrier substrate 1 and the flexible substrate 2;

[0052] The adhesive layer 3 includes a magnetic adhesive layer 31 whose adhesive...

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PUM

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Abstract

The invention discloses a base plate structure, an adhering method and peeling method of a flexible base plate thereof. The base plate structure comprises a carrier base plate, a flexible base plate arranged on the carrier base plate, one or more parallelly arranged adhering layers clamped between the carrier base plate and the flexible base plate; the adhering layers comprises magnetic adhering layers with converting adhering strength under the effect of a magnetic field; the sides of the adhering layers contacting with the flexible base plate are equipped with magnetic adhering layers. Because the magnetic adhering layers with converting adhering strength under the effect of the magnetic field are arranged on one side of the flexible base plate in the base plate structure, the flexible base plate can be adhered and peeled in the manufacturing process through the magnetic adhering layers under the effect of the magnetic field; and the carrier base plate and the adhering layers can be recycled.

Description

technical field [0001] The invention relates to the technical field of substrate manufacturing, in particular to a substrate structure and a method for attaching and peeling off a flexible substrate thereof. Background technique [0002] In recent years, flexible display has developed rapidly as a key technology for next-generation display. Flexible display devices use a rollable flexible substrate, which is made of soft materials and is characterized by variable shape, bendability, and light and thin , Easy to carry and so on. [0003] At present, the processing of flexible substrates is difficult, which seriously limits its application development. Generally, flexible substrates are fixed on rigid carrier substrates. However, the attachment process of flexible substrates is relatively complicated, and it is not easy to peel off the finished flexible substrates. At present, there are many ways to fix the flexible substrate to the carrier substrate, which can be roughly div...

Claims

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Application Information

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IPC IPC(8): H01L27/12H01L21/762H01L21/78
CPCH01L21/76251H01L21/7813H01L27/12H01L21/762G02F1/133305B32B37/1284B32B38/10B32B43/006B32B2307/208B32B2327/06B32B2367/00B32B2457/20H01L27/1266H01L27/1218H10K71/80H10K59/1201B32B3/16B32B7/12
Inventor 邢建国赛加坐喻娟王凤
Owner BOE TECH GRP CO LTD
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