Composite LED circuit board and manufacturing method thereof
A technology of LED circuit board and manufacturing method, which is applied in the direction of printed circuit manufacturing, circuit, printed circuit, etc., can solve the problems of poor connection consistency and reliability, complicated connection process, and increased manufacturing cost between the light board and the LED driver board, and achieve Good consistency, simplified connection structure, and improved matching accuracy
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Embodiment 1
[0044] Embodiment 1: as figure 1 , figure 2 As shown, a composite LED circuit board includes an aluminum substrate 11, the thickness of the aluminum substrate is between 0.8-1.5mm, an inlay hole 111 is set on the aluminum substrate, and an insulating substrate whose shape matches the inlay hole is embedded in the inlay hole. 21, thereby forming a composite substrate. The insulating substrate is made by stamping an existing laminated substrate such as FR-1 for making PCB boards, and one surface of the aluminum substrate is flush with the corresponding surface of the insulating substrate. Then, an insulating layer 31 and a conductive copper foil 32 for conducting electricity are sequentially arranged on the flat surface of the composite substrate from inside to outside, thereby forming a composite PCB board. The composite PCB board is provided with a driving power supply element 33 at the corresponding insulating substrate, thereby constituting the driving board in the LED li...
Embodiment 2
[0046] Embodiment 2: a kind of manufacturing method of composite LED circuit board, comprises the following steps:
[0047] a. If image 3 As shown, on an aluminum plate 1 with a thickness of 0.8-1.5 mm, a number of circular aluminum substrates 11 in a rectangular array are punched out with a punching die. The interior of the aluminum substrate is an inlay hole 111, and two adjacent aluminum The outer edges of the substrates are connected by connecting strips 13 with a width of 0.5-1mm, and an insulating substrate whose shape is adapted to the inlay hole and has the same thickness as the aluminum substrate is obtained by punching on the laminator plate. In order to facilitate the subsequent processing of the aluminum plate, we can punch out positioning holes 12 on the diagonal positions of the aluminum plate while stamping the aluminum base plate on the aluminum plate;
[0048] b. Insert the insulating substrates into the mosaic holes of the aluminum substrates respectively, ...
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Abstract
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