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Composite LED circuit board and manufacturing method thereof

A technology of LED circuit board and manufacturing method, which is applied in the direction of printed circuit manufacturing, circuit, printed circuit, etc., can solve the problems of poor connection consistency and reliability, complicated connection process, and increased manufacturing cost between the light board and the LED driver board, and achieve Good consistency, simplified connection structure, and improved matching accuracy

Active Publication Date: 2016-11-30
NINGBO KLITE ELECTRIC MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the complex connection process between the lamp board and the LED driver board existing in the circuit board of the existing LED lighting lamp, which is labor-intensive, thereby increasing the manufacturing cost, and making the connection between the lamp board and the LED driver board Consistency and poor reliability, provide a composite LED circuit board and its manufacturing method, which can significantly simplify the connection between the light board part and the LED driver board part, and the consistency and reliability of the connection between the two High reliability, which is conducive to saving labor and reducing manufacturing costs

Method used

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  • Composite LED circuit board and manufacturing method thereof
  • Composite LED circuit board and manufacturing method thereof
  • Composite LED circuit board and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0044] Embodiment 1: as figure 1 , figure 2 As shown, a composite LED circuit board includes an aluminum substrate 11, the thickness of the aluminum substrate is between 0.8-1.5mm, an inlay hole 111 is set on the aluminum substrate, and an insulating substrate whose shape matches the inlay hole is embedded in the inlay hole. 21, thereby forming a composite substrate. The insulating substrate is made by stamping an existing laminated substrate such as FR-1 for making PCB boards, and one surface of the aluminum substrate is flush with the corresponding surface of the insulating substrate. Then, an insulating layer 31 and a conductive copper foil 32 for conducting electricity are sequentially arranged on the flat surface of the composite substrate from inside to outside, thereby forming a composite PCB board. The composite PCB board is provided with a driving power supply element 33 at the corresponding insulating substrate, thereby constituting the driving board in the LED li...

Embodiment 2

[0046] Embodiment 2: a kind of manufacturing method of composite LED circuit board, comprises the following steps:

[0047] a. If image 3 As shown, on an aluminum plate 1 with a thickness of 0.8-1.5 mm, a number of circular aluminum substrates 11 in a rectangular array are punched out with a punching die. The interior of the aluminum substrate is an inlay hole 111, and two adjacent aluminum The outer edges of the substrates are connected by connecting strips 13 with a width of 0.5-1mm, and an insulating substrate whose shape is adapted to the inlay hole and has the same thickness as the aluminum substrate is obtained by punching on the laminator plate. In order to facilitate the subsequent processing of the aluminum plate, we can punch out positioning holes 12 on the diagonal positions of the aluminum plate while stamping the aluminum base plate on the aluminum plate;

[0048] b. Insert the insulating substrates into the mosaic holes of the aluminum substrates respectively, ...

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Abstract

Composite LED circuit board (and manufacturing method) comprising a (e.g circular) aluminum substrate 11 comprising a punched out inlayed hole 111 forming a circular / annular structure and an inlayed insulating substrate 21 flush with the surfaces of the aluminium substrate 11, inlayed within the hole 111. A semi-dry insulating adhesive 31 and a conductive copper foil 32 are sequentially deposited on the upper and lower surface and constant temperature and pressure applied to solidify and complete the composite PCB. A driving power supply element 33 is arranged on the insulating substrate of the composite PCB forming a drive board, whilst LED lamp beads 35 are arranged on the PCB periphery upon the aluminum substrate 11, thus completing a lamp panel. The lamp panel and drive board are connected via the conductive copper foil 32, whilst the electrical connections established are of good consistency and reliability, reducing manufacturing costs. Semicircular protrusions 112 may be formed on the edge of the aluminium annulus inside the inlayed hole. A dedicated hole punching die comprising an upper and lower die (figure 4) may stamp out the circular shape and annular inlay hole in the aluminium substrate (figures 3-5).

Description

technical field [0001] The invention relates to the field of LED lamp manufacturing, in particular to a composite LED circuit board which combines an LED lamp board and an LED driving board and a manufacturing method thereof. Background technique [0002] LED (Light Emitting Diode) is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electricity into light. LED lights made of LEDs have many advantages such as energy saving, environmental protection, long service life, no flicker and can work under low voltage, safety and reliability, etc., so they are being promoted and popularized rapidly. At present, LED lighting usually includes an LED light board and a driving power supply for driving. The LED light board includes a light board with LED lamp beads attached, and the driving power includes an LED driver board soldered with components. Since the light board needs to have good heat dissipation performance, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V23/00F21V23/06F21V19/00F21Y115/10
CPCF21V19/0025F21V23/005F21V23/06H05K1/056H05K1/142H05K3/005H05K2201/09027H05K2201/10106H05K2201/10545F21K9/278F21V23/00H01L25/167H01L33/486H01L33/507H01L33/62H01L33/64
Inventor 夏奇军周小军贺敏明姚斌雄
Owner NINGBO KLITE ELECTRIC MFG