Alignment method and alignment device

Abstract

Provided is an alignment method which is practically superior in capabilities for carrying out high precision alignment. When alignment of a substrate (12) and the mask (11) is carried out, a second imaging unit (14) with a high imaging magnification is positioned using imaging data imaged by a first imaging unit (13) with a low imaging magnification. Two stages of steps are carried out for positional correction for the substrate (12) and the mask (11) with the imaging range of the second imaging unit (14) as a reference: a first alignment step that is carried out using imaging data imaged by the first imaging unit (13), and a second alignment step that is carried out using imaging data imaged by the second imaging unit (14).

Description

technical field [0001] The present invention relates to an alignment method and an alignment device. Background technique [0002] For example, the following alignment device is disclosed in the known patent document 1. The alignment device is provided in a film forming device to perform alignment between a mask and a substrate. A film-forming material is deposited on the substrate, thereby forming a thin film on the substrate. [0003] However, in recent years, higher-precision alignment is required, and a high-magnification camera is often used to image a mask mark and a board mark to perform alignment. Alignment using this high magnification camera is for example according to figure 1 The illustrated flow proceeds. [0004] Specifically, the mask is carried into the processing chamber (a.), the carried-in mask is set on the mask holder (b.), the substrate is carried into the processing chamber by a transport robot (c.), and the two ends of the substrate are Apply exte...

AI Technical Summary

Problems solved by technology

[0005] However, the above-mentioned conventional alignment uses a high-magnification camera. As a result, the imaging field of view is narrow, and mask marks and substrate marks cannot be brought into the imaging field of view, resulting in poor alignment.

[0006] Furthermore, since the mask transfer accuracy is low, the position of the mask mark may not coincide with the imaging center of the camera set at a predetermined position during rough positioning, thereby reducing the alignment accuracy.

[0007] In addition, during rough positioning, since the rough positioning is performed by directly applying an external force to the substrate, if the edge of the contact position of the substrate stands up, the force will concentrate on one point of the contact edge, and the substrate may be damaged.

Especially for large substrates, due to the increase in self-weight, the force applied to one point increases, and the risk of damage increases

[0008] Furthermore, fragments of the damaged substrate adhere to the substrate or the like, thereby possibly causing a reduction in the production efficiency of the device

Images