Method for adding scaling powder into solder

Abstract

The invention discloses a method for adding scaling powder into solder. The method includes the following steps that the scaling powder and the solder are processed into powder, and powdery scaling powder and powdery solder are obtained; the powdery scaling powder and the powdery solder are mixed and stirred to be even in proportion; the powdery scaling powder and the powdery solder which are mixed and stirred to be even are pre-pressed into extruding ingots; the extruding ingots are finally placed into an extruding machine to be extruded into a solder product. The method is easy to apply and is a processing method in which the scaling powder and the solder are mixed to be even in a powder-mixing mode and then extruded into the solder, in practical use of the solder, splashing of the scaling powder can be avoided, and the method can be used for adding scaling powder into any solder alloy.

Description

technical field [0001] The invention relates to the field of flux, in particular to a method for adding flux to solder materials. Background technique [0002] There are two types of techniques for adding flux to solder on the market. One is to inject flux into the center of the solder. In this method, the content of flux will produce unstable changes during the production process, and the interruption of flux feeding cannot be detected. As a result, the flux is interrupted in the hollow, because the flux is concentrated in the center of the solder wire. When the solder product is used in welding, the flux in the center of the solder will splash, which will affect the user and affect the quality of the soldered product. [0003] One is to coat the flux on the surface of the solder. This method is very troublesome and pollutes the environment, and the coating effect is not good. [0004] In addition, there is another type of solder product that cannot be added with flux by c...

AI Technical Summary

Problems solved by technology

[0002] There are two types of techniques for adding flux to solder on the market. One is to inject flux into the center of the solder. In this method, the content of flux will produce unstable changes during the production process, and the interruption of flux feeding cannot be detected. It leads to the occurrence of hollow interruption flux, because the flux is concentrated in the center of the solder wire. When solder products are used in welding, the flux in the center of the solder will splash, which will affect the user and affect the quality of the soldered product.

[0003] One is to coat the flux on the surface of the solder, which is very troublesome and pollutes the environment, and the coating effect is not good

[0004] In addition, there is another type of solder product that cannot be added with flux by conventional center injection due to its special physical characteristics.

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