A clean micro-charge process suitable for mems micro-thruster array chip

Abstract

The present invention is a clean micro-powdering process suitable for MEMS micro-thruster array chips, comprising the following steps: 1) according to the diameter and distribution of the micro-chamber array layer, the corresponding partitions are processed on the partition plate with the micro-hole array. Plate micro-through holes, fix the separator with micro-hole array on the surface of the micro-chamber array layer; 2) Fill the micro-chamber with propellant energetic material; 3) Remove the micro-hole array on the upper surface of the micro-chamber array layer The partition plate, exposing the clean process surface of the micro-chamber array layer protected by the partition board with micro-hole array; 4) performing subsequent bonding steps, by ensuring the cleanliness of the surface of the micro-chamber array layer. Advantages: 1) It has wide material adaptability; 2) The microhole array on the separator can be processed by MEMS technology, which has high precision and high efficiency; 3) High-precision positioning marks can be easily processed on the separator. The process can ensure that the micro-hole array of the partition is concentric with the micro-chamber array up and down, ensuring the smooth completion of the micro-powdering process.

Description

technical field [0001] The present invention relates to the technical field of micro-thruster array chips based on MEMS technology, in particular, to the MEMS micro-thruster array chip technology in which propellants and other energetic materials are filled in micro-chamber arrays to realize micro-thrust / micro-impulse generation field. Background technique [0002] At present, MEMS micro-thrust array chip technology is a powerful competitive technology that meets the needs of micro-spacecraft attitude and orbit control represented by micro-satellites and micro-satellite constellations. With the advancement of MEMS technology, the diameter of the micro-chamber of the MEMS micro-thruster array chip has entered the sub-millimeter scale, ensuring that the high-density micro-chamber array layer is clean after the micro-charge is completed. It is one of the key technologies for successful bonding of micro-jet array layers and improvement of bonding performance. So far, most of t...

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Problems solved by technology

[0004] The present invention proposes a clean micropowdering process suitable for MEMS microthruster array chips, and its purpose is to improve the cleanness between the micropowder chamber array layer and the microjet hole array layer during the processing of MEMS microthruster array chips. Excellent bonding efficiency and bonding performance; solve the technical problems that plague the preparation and performance of MEMS micro-thruster array chips in the prior art and affect the low bonding efficiency and bonding strength of the micro-chamber array layer and the micro-jet array layer, etc. craft problem

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