A filter detection pipeline type liquid cooling device

Abstract

The invention relates to a filtering detection pipeline type liquid radiating device. A band-new design structure is used, a nested structure that an outer pipe (1) and an inner pipe (2) are embedded with each other is designed, based on the flowing of liquid designed in the inner pipe (2), a temperature difference between a clearance environment between the outer pipe (1) and the inner pipe (2) and an area to be radiated where the outer pipe (1) is located is generated, and the convection between the air of the area to be radiated where the outer pipe (1) is located and the air of the clearance environment between the outer pipe (1) and the inner pipe (2) is realized through ventilation holes (9) in the surface of the outer pipe (1); meanwhile, a temperature detection result for the area to be radiated where the outer pipe (1) is located from a temperature sensor (5) is obtained through a filtering circuit (10), the operation of a fan (6) designed and located at the open end of the outer pipe (1) is controlled, and the flowing for air in the clearance environment between the outer pipe (1) and the inner pipe (2) is accurately guided, so that the radiating work efficiency of the filtering detection pipeline type liquid radiating device designed in the invention in the practical application process is effectively guaranteed.

Description

technical field [0001] The invention relates to a filter detection pipeline type liquid heat dissipation device, which belongs to the technical field of heat dissipation of electronic equipment. Background technique [0002] With the continuous development of electronic technology, all kinds of electronic products are constantly entering our daily life, ranging from large household appliances such as refrigerators and color TVs to small computer switch socket panels, all of which are products of the development of electronic technology. With the continuous development of electronic equipment, the heat generated by electronic equipment is gradually being valued by people. People find that the overheated environment will affect the performance of electronic products. For this reason, various heat dissipation devices have emerged and are being continuously improved. and innovation, such as patent application number: 201310622519.9, discloses a heat sink, including a body and a ...

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Problems solved by technology

[0005] It can be seen from the above prior art that the existing heat dissipation devices are improved and innovated in structure and function to achieve heat dissipation for the heat generated by electronic equipment and ensure the working efficiency of electronic products. However, with the continuous improvement of heat dissipation devices It can be found that the existing heat dissipation devices still have unsatisfactory places. Most of the existing heat sinks are set in the heat area, and the heat is directly conducted to the external environment through the design structure. This is to achieve heat dissipation for the heat. However, the heat dissipated into the external environment will affect the external environment, and the existing heat dissipation methods are relatively common, that is, based on heat conduction materials and fans to achieve heat conduction, the actual heat dissipation efficiency is relatively low

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