A hollow ceramic bead peek composite copper clad laminate and its preparation method
A technology of ceramic microbeads and copper-clad laminates, which is applied in the direction of chemical instruments and methods, synthetic resin layered products, lamination, etc., can solve the problems of lack of hollow ceramic microbeads application technology, etc., to improve electrical and mechanical properties, dielectric properties, etc. The effect of small constant and high rigidity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0016] Example 1: 10 parts by weight of ceramic microbeads were activated and treated with 0.5 parts by weight of silane coupling agent, and then mixed with 90 parts by weight of PEEK at 320° C. for molding. Under the vacuum condition of 90Kpa, the copper foil was hot-laminated and pressed for 6 hours in an electric heating laminator at a temperature of 380°C and 15Mpa. The dielectric constant of the laminate material is 3.15 and the dissipation factor is 0.007.
Embodiment 2
[0017] Example 2: 20 parts by weight of ceramic microbeads were activated with 1.0 parts by weight of titanate coupling agent, and then mixed with 80 parts by weight of PEEK at 340° C. for molding. Under the vacuum condition of 90Kpa, the temperature is 370°C, and the pressure is held in an electric heating laminator at 15Mpa for 5 hours to thermally laminate the copper foil, and the thickness of the copper foil is 0.01mm. The dielectric constant of the laminate material is 2.7 and the dissipation factor is 0.0035.
Embodiment 3
[0018] Example 3: 30 parts by weight of ceramic microbeads were activated with 1.5 parts by weight of silane coupling agent, and then mixed with 70 parts by weight of PEEK at 360° C. for molding. Under the vacuum condition of 90Kpa, the temperature is 360°C, and the pressure is held in an electric heating laminator at 16Mpa for 5 hours to thermally laminate the copper foil, and the thickness of the copper foil is 0.05mm. The dielectric constant of the laminate material is 2.3 and the dissipation factor is 0.0026.
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More