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A hollow ceramic bead peek composite copper clad laminate and its preparation method

A technology of ceramic microbeads and copper-clad laminates, which is applied in the direction of chemical instruments and methods, synthetic resin layered products, lamination, etc., can solve the problems of lack of hollow ceramic microbeads application technology, etc., to improve electrical and mechanical properties, dielectric properties, etc. The effect of small constant and high rigidity

Active Publication Date: 2018-03-13
ZIBO MAITERUI ENG MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although some scholars have studied the application of hollow glass microspheres in polytetrafluoroethylene (PTFE) and other materials, there is a lack of research on the application process of hollow ceramic microspheres in PEEK materials with very characteristic molding process and performance.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Example 1: 10 parts by weight of ceramic microbeads were activated and treated with 0.5 parts by weight of silane coupling agent, and then mixed with 90 parts by weight of PEEK at 320° C. for molding. Under the vacuum condition of 90Kpa, the copper foil was hot-laminated and pressed for 6 hours in an electric heating laminator at a temperature of 380°C and 15Mpa. The dielectric constant of the laminate material is 3.15 and the dissipation factor is 0.007.

Embodiment 2

[0017] Example 2: 20 parts by weight of ceramic microbeads were activated with 1.0 parts by weight of titanate coupling agent, and then mixed with 80 parts by weight of PEEK at 340° C. for molding. Under the vacuum condition of 90Kpa, the temperature is 370°C, and the pressure is held in an electric heating laminator at 15Mpa for 5 hours to thermally laminate the copper foil, and the thickness of the copper foil is 0.01mm. The dielectric constant of the laminate material is 2.7 and the dissipation factor is 0.0035.

Embodiment 3

[0018] Example 3: 30 parts by weight of ceramic microbeads were activated with 1.5 parts by weight of silane coupling agent, and then mixed with 70 parts by weight of PEEK at 360° C. for molding. Under the vacuum condition of 90Kpa, the temperature is 360°C, and the pressure is held in an electric heating laminator at 16Mpa for 5 hours to thermally laminate the copper foil, and the thickness of the copper foil is 0.05mm. The dielectric constant of the laminate material is 2.3 and the dissipation factor is 0.0026.

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PUM

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Abstract

The invention discloses a hollow ceramic microbead PEEK composite copper-clad plate which is prepared from, by weight, 0-50 parts of ceramic microbeads, 0-5 parts of a coupling agent and 50-100 parts of PEEK. The invention further discloses a preparation method of the composite copper-clad plate. The preparation method comprises the first step of mixing-forming, wherein the ceramic microbeads are activated through the coupling agent, then the PEEK is added in, and mixing-forming is carried out at the temperature of 320-400 DEG C; the second step of hot layer lamination, wherein the material obtained through mixing-forming in the first step is subjected to copper foil lamination, and the pressure is kept for 3-6 h in an electric heating laminating machine at the temperature of 350-380 DEG C and the pressure of 15-20 Mpa. The hollow ceramic microbead PEEK composite copper-clad plate has the advantages that the preparation method of the hollow ceramic microbead PEEK composite copper-clad plate is provided, and the obtained hollow ceramic microbead PEEK composite copper-clad plate has the advantages of being extremely low in dielectric constant (0-1.34), low in dielectric loss, extremely high in heat resistance and the like, and the tensile strength and water absorption are slightly lowered.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a hollow ceramic bead PEEK composite copper-clad laminate and a preparation method thereof. Background technique [0002] Polyetheretherketone (PEEK) resin is a special engineering plastic with excellent performance. Compared with other special engineering plastics, it has many significant advantages, such as high temperature resistance, excellent mechanical properties, good self-lubrication, chemical corrosion resistance, flame Peel resistance, radiation resistance, stable insulation, hydrolysis resistance and easy processing, etc., are used in aerospace, automobile manufacturing, electrical and electronic, medical and food processing and other fields. It is also used in high-frequency substrate materials, especially in ground microwave video, satellite communications, mobile phones, military radar, aerospace, missile navigation and other fields, but PEEK m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/06C08K9/06C08K9/04C08K7/24B32B27/28B32B27/18B32B15/20B32B15/08B32B33/00B32B37/06B32B17/10
CPCB32B15/08B32B15/20B32B27/18B32B27/28B32B33/00B32B37/06B32B37/1018C08K7/24C08K9/04C08K9/06C08K2201/011C08L61/06
Inventor 段辉王海宁
Owner ZIBO MAITERUI ENG MATERIAL CO LTD