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Heat pipe cooling system and working medium

A technology of heat pipe working medium and plating solution, applied in hot dip plating process, indirect heat exchanger, heat exchange material, etc., can solve problems such as poor heat exchange effect

Active Publication Date: 2018-08-07
TIANJIN JUNYITAI TECH DEV CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The method adopted in the above-mentioned patent documents has poor heat transfer effect and cannot fundamentally solve the problem of rapid heat transfer

Method used

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  • Heat pipe cooling system and working medium
  • Heat pipe cooling system and working medium
  • Heat pipe cooling system and working medium

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Embodiment Construction

[0018] The present invention will be further described in detail below in conjunction with the accompanying drawings and through specific embodiments. The following embodiments are only descriptive, not restrictive, and cannot limit the protection scope of the present invention.

[0019] A heat pipe plating solution cooling system, comprising a plating solution cooling treatment box 7, a heat pipe 4, a refrigeration box 2 and a refrigeration unit 1, the left and right sides of the plating solution cooling treatment box are respectively equipped with a plating solution 8 inlet 11 and a plating solution outlet 10, The liquid cooling treatment box and the refrigeration box are made of airtight insulation materials. A refrigeration box is installed on the upper part of the plating solution cooling treatment box. A refrigeration unit is installed on one side of the refrigeration box. On the side wall (5 and 6) are installed with a heat pipe running through, the condensation section ...

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Abstract

The invention relates to a heat pipe plating solution cooling system and a working medium. The heat pipe plating solution cooling system comprises a plating solution cooling treatment box, heat pipes, a refrigeration box and a refrigeration unit; and the heat pipes are installed between adjacent side walls of the refrigeration box and the plating solution cooling treatment box in a penetrating manner, condensation sections of the heat pipes are arranged in the refrigeration box at the upper portion, and evaporation sections of the heat pipes are arranged in the plating solution cooling treatment box at the lower portion. According to the heat pipe plating solution cooling system, the characters of instant pulverization and top-speed conduction of the heat pipes are used, the evaporation ends of the heat pipes are arranged in a plating solution to evaporate and extract the too-high heat in the plating solution through a working medium solution, the too-high heat is emitted from the condensation ends, and the condensation ends are arranged in a closed refrigerating system to cool evaporated hot air in a forced manner; and the system is automatically stopped when the temperature of the plating solution reaches the temperature needed by production, the system is automatically started when the temperature rises again, and therefore the aim of obtaining the constant temperature is achieved.

Description

technical field [0001] The invention belongs to the field of energy-saving equipment, in particular to a heat pipe coating solution cooling system and working medium. Background technique [0002] The heat pipe is a heat transfer element called "heat pipe" invented by G.M.Grover of the Los Alamos National Laboratory in the United States in 1963. Rapidly transferred to the outside of the heat source, its thermal conductivity exceeds that of any known metal. Heat pipe technology was widely used in aerospace, military and other industries before. Since it was introduced into the radiator manufacturing industry, people have changed the traditional radiator design ideas and got rid of the single heat dissipation mode that only relies on high air volume motors to obtain better heat dissipation. [0003] In the production process of tinplate, the temperature of the tin plating solution will become higher and higher as the production continues. When the temperature of the tin plati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D21/02C23C2/00C09K5/10F28D15/02
CPCC09K5/10C23C2/003C25D21/02F28D15/02
Inventor 陈佳冬吕静远
Owner TIANJIN JUNYITAI TECH DEV CO LTD