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Array substrate, manufacturing method thereof, and display device

A technology of array substrates and substrate substrates, applied in the direction of instruments, semiconductor devices, electrical components, etc., can solve problems such as no solutions provided, achieve the effect of improving product yield and avoiding bad display phenomena

Active Publication Date: 2020-02-07
BOE TECH GRP CO LTD +1
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  • Abstract
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  • Application Information

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Problems solved by technology

[0004] However, for the above-mentioned defects, an effective solution is not provided in the prior art

Method used

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  • Array substrate, manufacturing method thereof, and display device
  • Array substrate, manufacturing method thereof, and display device
  • Array substrate, manufacturing method thereof, and display device

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] An embodiment of the present invention provides an array substrate. The array substrate includes a base substrate, a passivation layer and an orientation layer disposed on the base substrate, the passivation layer has a via hole structure penetrating the passivation layer, and the via hole structure includes: The first part and the second part, the first part is close to the base substrate, the second part is close to the alignment layer, ...

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Abstract

The invention discloses an array substrate, a fabrication method therefore and a display device. The fabrication method of the array substrate comprises the steps as follows: forming a passivation layer on a substrate, and forming a via hole structure which penetrates the passivation layer and is formed by a first part and a second part mutually communicated, wherein the first part is close to the substrate, the second part is away from the substrate, orthographic projection of the first part on the substrate completely falls into an orthographic projection region on the substrate; forming an orientation layer. By means of the array substrate, the fabrication method thereof and a display device, an alignment film with more uniform thickness can be formed on the array substrate, accordingly, bad displays can be prevented, and the effect of improving the yield rate of the array substrate product is achieved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate, a manufacturing method thereof, and a display device. Background technique [0002] With the high-resolution development requirements of liquid crystal display products, the pixel density on the array substrate is getting higher and higher, which brings great challenges to the PI (Polyimide, alignment film) coating process on the array substrate. At present, the alignment film inkjet printing technology is usually used in the alignment film coating process, but with the continuous improvement of the pixel density on the array substrate, the probability of poor diffusion of the alignment film is increasing, resulting in the alignment film on the array substrate. Overlay is prone to Mura (poor display) phenomenon. [0003] For example, on ADS (Advanced super Dimension Switch, advanced ultra-dimensional field switching technology) display products, the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12G02F1/1333
CPCG02F1/1333G02F1/133302H01L27/1262
Inventor 王丹马国靖任锦宇徐长健周波
Owner BOE TECH GRP CO LTD
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