Functional printing and decorative printing integrated product and preparation method thereof
A functional and product technology, applied in the field of functional decorative printing products and their preparation, can solve the problems of high cost, complex process, different adhesion of adhesive layers, etc., to simplify the manufacturing process, reduce costs, and reduce costs cost effect
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Embodiment 1
[0038] Such as figure 1 As shown, this embodiment relates to a product with functional decorative printing. Specifically, the product includes in order from bottom to top: a first adhesive layer 1 (adhesive), an ESD layer 2, an insulating Layer 3, circuit layer 4, fixing sheet 5, transparent conductive layer 6, second adhesive layer 7, decorative film 8 and functional printing layer 9, the functional printing layer 9 is arranged on the decorative film so that the product has an appearance at the same time Decorative and functional.
[0039] In a preferred embodiment of the present invention, the functional printing layer 9 is ink.
[0040] In a preferred embodiment of the present invention, the above-mentioned product can be applied to the steering wheel, especially the multifunctional steering wheel, and the mask with touch function is combined with the injection molded parts, which not only meets the requirements of appearance and function , as a structural part to optimiz...
Embodiment 2
[0042] Such as figure 2 As shown, this embodiment relates to a preparation method of functional decorative printed products, specifically, the method includes:
[0043] Step S1, providing a first adhesive layer, which is suitable for the process used to make IMD (in-mold decoration) injection molded parts, that is to say, this process can be used together with the injection molded parts.
[0044] Step S2, forming a circuit layer on the first adhesive layer.
[0045] In a preferred embodiment of the present invention, the step of forming a circuit layer on the first bonding layer specifically includes:
[0046] Firstly, an ESD layer is formed on the first bonding layer.
[0047] Secondly, an insulating layer is formed on the ESD layer to isolate the ESD layer and the wiring layer.
[0048] Step S3, forming a decorative mask on the circuit layer.
[0049] In a preferred embodiment of the present invention, the step of forming a decorative mask on the circuit layer specifica...
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