Array substrate and manufacturing method thereof

Abstract

The present invention provides an array substrate, which includes: a display area and a packaging area. The packaging area includes multiple functional layers. The packaging area also includes through holes that penetrate at least one functional layer. The hole is used to allow the encapsulant to flow into the through hole; the groove is arranged above at least part of the through hole, wherein the projection area of ​​the at least part of the through hole on the base substrate of the array substrate is located The trench is within a projected area on the base substrate.

Description

technical field [0001] The invention relates to the field of displays, in particular to an array substrate of a display device and a manufacturing method thereof. Background technique [0002] The manufacturing process of the display device needs to be packaged, and the quality of the package has a great impact on the yield [0003] figure 1 A conventional packaging structure disposed on an array substrate is shown. The array substrate includes a glass substrate 100, a buffer layer 201, a gate insulating layer 202, a gate metal layer 203, an intermediate insulating layer 204, a source-drain metal layer 205, an organic layer 206, spacers 207 and a cover glass 900, wherein the The package structure includes a through hole 903 provided on a part of the functional layer of the array substrate, and the package glue 902 flows in through the through hole 903 to be in contact with the gate metal. [0004] Such as figure 2 As shown, it further shows the structure of the through ...

AI Technical Summary

Problems solved by technology

[0006] During assembly, the packaging glue is melted by laser, and the packaging structure of the above-mentioned "I"-shaped through hole causes the packaging glue to overflow;

[0007] The packaging structure of the above-mentioned "I"-shaped through hole leads to a large residual stress inside the array substrate after packaging, which causes cracking of the packaging glue;

[0008] With the above package structure, the mechanical strength of the package is not enough. When testing the finished product, water vapor and oxygen are easy to enter the array substrate, resulting in failure of the display device.

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