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Diffraction optical member and conductor laser-diffraction optical member module

A technology of diffractive optical elements and semiconductors, applied in optical elements, optics, instruments, etc., can solve the problems of increasing assembly costs and difficulty in accommodating, and achieve the effects of reducing assembly costs, reducing materials and assembly costs, and shortening the length

Inactive Publication Date: 2016-06-22
AHEAD OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the above-mentioned light source architecture, the working distance between the semiconductor laser 12 and the collimating mirror 14 is specific and requires high accuracy, thus increasing the assembly cost
In addition, the overall length or thickness of the light source that requires the above three components is also considerable, and it may be difficult to accommodate it on a thinner and lighter mobile device

Method used

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  • Diffraction optical member and conductor laser-diffraction optical member module
  • Diffraction optical member and conductor laser-diffraction optical member module
  • Diffraction optical member and conductor laser-diffraction optical member module

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Embodiment Construction

[0031] The diffractive optical element of the present invention and the semiconductor laser-diffractive optical element module integrated with the diffractive optical element are suitable for use in mobile devices such as smartphones as a laser light source. Currently, the size of semiconductor laser modules suitable for smartphones using TO-CAN packaged lasers is 6 x 6 x 7 mm (length x width x thickness), and will evolve to 4 x 6 x 4 mm in the future. Therefore, the thickness of the semiconductor laser-diffractive optical element module integrating the diffractive optical element of the present invention can be compressed to less than 4 millimeters. If a surface-mounted component (SurfaceMountDevice, SMD) packaged laser is further used, the thickness of the laser module can be reduced to 2mm, which is enough for a handheld device, and the laser module can also be directly mounted on a printed circuit board (PrintedCircuitBoard, PCB), Produced using the traditional way of punc...

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Abstract

The invention provides a diffraction optical member and a conductor laser-diffraction optical member module. The conductor laser-diffraction optical member module comprises a laser source module and the diffraction optical member, wherein the laser source module outputs a non-collimated point beam; the diffraction optical member receives the non-collimated point light beam coming from the laser source module and regulates the non-collimated point beam into the light with optical information. The diffraction optical member can receive the non-collimated point light beam. The invention can utilize the diffraction optical member which is capable of receiving the non-collimated point optical beam to cooperate the laser source module to emit the non-collimated point light beam. As a result, the invention can shorten the distance between the laser source module and the diffraction optical member and enables the length of the whole semiconductor laser-diffraction optical member module.

Description

technical field [0001] The invention relates to the field of semiconductor laser-diffractive optical element modules, in particular to the field of integrating semiconductor laser and diffractive optical element modules. Background technique [0002] Smartphones and other mobile devices are indispensable equipment in modern people's life. Under the design trend of large-size touchpads, mobile devices can have enough space to accommodate the required components. However, in addition to large-size touchpads, light and thin appearance is also the mainstream design of mobile devices. Therefore, when some components in the mobile device must be arranged in the mobile device in a specific way due to factors such as functions, the thickness or size of these components will have a direct relationship with the thinness of the mobile device. The thickness of the lens module of the smart phone is greater than that of the smart phone, so the lens module placed in the smart phone usuall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B27/09G02B27/42
Inventor 廖宏荣张颖岳颜智敏
Owner AHEAD OPTOELECTRONICS