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Wafer Material Removal

A wafer and beam technology, applied in the field of wafer material removal, can solve problems such as clogging of saw blades

Active Publication Date: 2019-10-11
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Mechanically sawn material, such as metal, can also clog the blades of the saw and thus require more frequent blade cleaning and / or replacement

Method used

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Examples

Experimental program
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Embodiment Construction

[0034] Laser grooving prior to mechanical sawing can remove some low-K, metal, and circuit structures, but often results in variable trench depths because metal and other device structures have varying thicknesses and densities. These inconsistent laser grooves leave small amounts of material that can also cause collateral damage and / or clog the cutting blade.

[0035] Figure 1A , Figure 1B and Figure 1C An example 100 laser grooving-cutting process is shown. exist Figure 1A In , the structures 102 , 104 , 106 , 108 are fabricated on a silicon wafer 110 . A sawing line 112 is defined between the two structures 102 and 104 .

[0036] To begin the cutting process, a laser 114 is applied to the structures 106 , 108 at a saw line 112 . The structures 106 , 108 are then removed, thereby creating the groove 116 . A dicing blade 118 is applied to the slot 116 to complete severing of the wafer 110 .

[0037] If the saw cut line 112 contained only the structures 106, 108, the...

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PUM

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Abstract

One example discloses a system for wafer material removal comprising: a wafer structure map identifying a first device structure having a first location and a second device structure having a second location; a material removal controller coupled to the The block diagram above, and having a material removal beam power level output signal and a material removal beam on / off status output signal; wherein the material removal controller is configured to select a first material removal beam power corresponding to a first position level and first material removal beam on / off state; and wherein the material removal controller is configured to select a second material removal beam power level and a second material removal beam on / off corresponding to the second location state. Another example discloses an article comprising at least one non-transitory tangible machine-readable storage medium containing executable machine instructions for wafer material removal.

Description

technical field [0001] Various example embodiments of systems, methods, apparatus, apparatus, articles of article, and computer readable media for wafer material removal are now discussed. Background technique [0002] Mechanical sawing (eg, blade dicing) of certain wafer materials (eg, silicon) can be an effective way to separate devices on a wafer. However, mechanical sawing of other materials, such as relatively brittle low-K materials, can cause collateral damage to wafer devices and structures, thereby affecting wafer yield. Such damage may be even more damaging to ultra-low K dielectric materials. [0003] The prepared wafer may also include various structures that need to be severed during chip dicing. For example, empty sections of saw lanes may be interspersed with saw lines filled with process control modules (PCMs) or metal tile structures. Fabricate PCMs to monitor technology-specific parameters such as V in CMO th and bipolar in V be . These structures can...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67092H01L21/78B24C1/045H01L21/268B23K2103/56B23K26/364B23K10/006B23K26/0626B23K26/14B23K26/402H01J37/3023H01J37/305H01J37/31H01L21/2633H01L21/3065
Inventor 萨沙·默勒托马斯·罗勒德古伊多·阿尔贝曼马丁·拉普克哈特莫特·布宁
Owner NXP BV